Filament Guide Angle Control for Precise Laser Wire Ablation
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Solution Overview
Problem
Existing methods for preparing multilayer wires for electrochemical sensors face challenges in achieving high accuracy and production rate while minimizing the service life of processing beam sources, such as lasers, and ensuring high signal-to-noise ratio and linearity of sensor responses.
Innovation Solution
A device and process that includes a processing beam source and a guiding mechanism to incline the filament at specific angles during laser ablation, allowing for efficient processing of multilayer wires by interacting processing beams with the filament to remove outer layers, thereby enhancing production speed and accuracy without excessive wear on the processing equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser ablation methods are used to prepare multilayer wires, then manufacturing precision can be achieved, but productivity is reduced and service life of processing beam sources decreases
Solution Approach 1:
The patent applies dynamics by moving the filament through the processing beam in a controlled manner during ablation, rather than using static positioning. The guiding means dynamically adjusts the filament's position and orientation (inclining at 0-45 degrees to vertical) to optimize both processing precision and throughput, enabling continuous reel-to-reel or reel-to-cut processing while maintaining high manufacturing precision.
2Manufacturing precision
If conventional laser ablation methods are used to prepare multilayer wires, then manufacturing precision can be achieved, but service life of processing beam sources is reduced
Solution Approach 1:
The patent implements continuity of useful action by maintaining optimal filament positioning and orientation throughout the entire ablation process. The guiding means ensures continuous, stable interaction between the processing beam and filament without interruptions or adjustments that would increase laser load, thereby extending beam source service life while preserving manufacturing precision through consistent processing conditions.
3Ease of operation
If the filament is processed in traditional orientations, then ease of operation is maintained, but manufacturing precision and production rate are compromised
Solution Approach 1:
The patent applies parameter changes by modifying the filament's orientation parameter during processing - specifically inclining the filament at angles between 0 and 45 degrees to the vertical axis. This parameter adjustment optimizes the interaction geometry between the processing beam and filament, improving manufacturing precision and production rate while the guiding means automates the orientation control to maintain ease of operation.
4Productivity
If higher production rates are achieved through faster processing, then productivity improves, but manufacturing precision and signal-to-noise ratio deteriorate
Solution Approach 1:
The patent uses dynamics to enable faster processing speeds while maintaining precision. The guiding means dynamically controls the filament's movement and orientation in real-time, ensuring optimal positioning throughout the ablation process even at higher speeds. This dynamic control allows increased productivity without sacrificing manufacturing precision or the signal-to-noise ratio of the resulting sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-accuracy preparation of multilayer wires for electrochemical sensors with improved production rates and reduced downtimes, maintaining high signal-to-noise ratios and linearity of sensor responses while minimizing laser service life.
Implementation Method 1
high-precision laser ablation of the outer metal layer
Implementation Method 2
processing a segment of the filament by interaction of the at least one processing beam with the segment of the filament
Data Source
AI summary
One aspect is a device for processing a filament in a process stream, including at least one processing beam source, designed and arranged for emitting at least one processing beam which is suitable for processing a segment of the filament by interaction of the at least one processing beam with the segment of the filament, thereby obtaining a processed filament. The device includes a guide, including a filament feed which is arranged upstream of the at least one processing beam source, and is designed to feed the filament from a feed reel. The guide is designed and arranged to guide the filament so that during the processing the segment of the filament inclines an angle with a vertical axis in the range from 0 to 45°.