Filament Light Source Assembly Without Iron Wire Bracket
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Solution Overview
Problem
The existing production process of LED filament lamps is complex, costly, and prone to reliability and quality issues due to the need for iron wire brackets, soldering, and fragile ceramic substrates, which also block light emission.
Innovation Solution
A solder-free and iron-wire-bracket-free filament light source assembly is developed, utilizing a glass fiber plate with LED chips, a phosphor dielectric layer, and a plastic fixing member with a channel for plug-in connection of external conductive terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If an iron wire bracket is used to support the LED filament light source, then the light source can be supported and connected, but the bracket blocks light emission causing dark regions and shadow regions
Solution Approach 1:
The patent removes the iron wire bracket from the system entirely. The LED filament light source is directly mounted on the ceramic substrate without any supporting bracket, thereby eliminating the obstruction to light emission while maintaining structural support through the substrate itself.
Solution Approach 2:
The ceramic substrate serves multiple functions: it provides mechanical support for the LED chips, acts as a mounting platform, and eliminates the need for separate supporting brackets. This multi-functional design resolves the contradiction by making the support structure light-transparent.
2Reliability
If butt soldering or spot soldering is used to connect the light source to the iron wire bracket, then electrical connection is achieved, but tension and stress cause the solder joint to desolder
Solution Approach 1:
The patent eliminates the iron wire bracket and associated soldering connections entirely. The LED chips are directly mounted on the ceramic substrate, removing the source of tension and stress that caused solder joint failure.
Solution Approach 2:
The support function and electrical connection function are merged into a single integrated structure. The ceramic substrate directly supports the LED chips and provides electrical connection paths, eliminating the need for separate connecting components and soldering processes.
3Reliability
If an iron wire bracket with multiple connection steps is used, then the light source can be supported and connected, but the assembling process becomes complicated and time-consuming
Solution Approach 1:
The patent removes the iron wire bracket and all associated multi-step connection processes. The simplified structure allows for direct mounting of LED chips on the ceramic substrate, dramatically reducing assembly steps and production time.
Solution Approach 2:
The patent divides the device into two main functional segments: the ceramic substrate that provides support and mounting, and the LED chips that provide light emission. This segmentation eliminates the need for intermediate connecting components and simplifies the overall assembly process.
4Ease of manufacture
If a ceramic substrate is used for the light source, then the light source can be mounted, but the ceramic substrate is easy to break causing low production yield
Solution Approach 1:
The patent designs the ceramic substrate with increased thickness and optimized structural geometry to enhance its mechanical strength and resistance to breaking during transportation and assembly, providing prior protection against potential damage.
Solution Approach 2:
The patent uses a composite structure combining the ceramic substrate with the phosphor dielectric layer and encapsulation materials, creating a more robust integrated assembly that protects the ceramic from direct impact and stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the assembly process, eliminates desoldering and false soldering issues, and improves light emission by removing the need for iron wire brackets, resulting in higher production efficiency and quality reliability.
Implementation Method 1
A phosphor dielectric layer is further provided on the glass fiber plate. The phosphor dielectric layer covers each of the LED chips
Data Source
AI summary
The present invention discloses a filament light source assembly, a filament lamp string and a filament bulb. The filament light source assembly comprises a glass fiber plate and a plastic fixing member. In the present technical solution, LED chips are provided on the glass fiber plate, the glass fiber plate is fixed on the plastic fixing member, and an iron wire bracket is not needed as a supporting component. Moreover, after the glass fiber plate and the plastic fixing member are assembled, a plug-in connection space is formed, and is used for plug-in connection and fixation of two external conductive terminals, such that the conductive terminals are electrically connected to two pads. In addition, since no iron wire bracket needs to be used as a supporting component in the present solution, light emitted from a light source is not blocked, thereby improving the light emission effect.