Conductive Bonding Fill Head Motion for Mold-Free Solder Deposition

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Solution Overview

Problem

Current solder ball forming techniques require custom molds for each substrate design, leading to high costs and prolonged delivery times due to the need for new mask or mold production, and existing mold materials lack a global infrastructure for mass production.

Innovation Solution

A system and method for directly providing conductive bonding material, such as solder, onto a circuit supporting substrate using a fill head with linear or rotational motion, eliminating the need for custom molds by allowing the fill head to contact the substrate and guide the material into cavities, which can be implemented using current fill heads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If custom molds are used for each substrate design, then solder ball formation precision is improved, but manufacturing cost and delivery time increase

Engineering Contradiction:

Improvesolder ball formation precisionVSAvoidmold production cost and time

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies universality by using a single mold design that can accommodate multiple substrate designs through adjustable positioning mechanisms. The mold includes positioning features that can be reconfigured for different substrate layouts, eliminating the need to create custom molds for each substrate design while maintaining precise solder ball formation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies dynamics by incorporating adjustable and reconfigurable elements in the mold system. The mold positioning mechanisms allow dynamic adjustment of cavity positions and orientations to match different substrate designs, enabling the same mold to adapt to various configurations without requiring physical retooling.

Inventive Principle:

Principle #15Dynamics

2Productivity

If multiple copies of masks or molds are produced for throughput, then productivity is improved, but manufacturing cost increases

Engineering Contradiction:

Improveproduction throughputVSAvoidmold fabrication cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing the mold into multiple independent cavities that can operate simultaneously. Each cavity can form solder balls on different substrates in parallel, achieving high throughput without requiring multiple complete mold sets. The segmented cavity design allows individual cavities to be used or maintained independently.

Inventive Principle:

Principle #1Segmentation

3Device complexity

If rectangular molds with linear movement are used, then device complexity is reduced, but adaptability to different substrate designs is limited

Engineering Contradiction:

Improvemold structure simplicityVSAvoidsubstrate design flexibility

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent applies dimensionality change by adding rotational capability to the mold system. The mold can rotate to align with different substrate orientations, and cavities can be positioned in multiple dimensional arrangements, transforming a simple linear mold into a versatile multi-axial system that accommodates various substrate layouts.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the cost and time associated with mold production and delivery, enabling efficient solder deposition directly onto substrates while allowing for flexible substrate designs and rapid production, including the creation of solderable connections between layers.

Implementation Method 1

A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate.

Methodology Applied

Scientific Effect:

Data Source

PatentUS20070246511A1Conductive bonding material fill techniques

Publication Date: 2007.10.25 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.