Fill-Level Sensor Temperature Integration
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Solution Overview
Problem
Existing vibronic fill-level measuring devices require separate temperature sensors for accurate density measurements, which increase costs and pose risks due to additional process connections, and integrating a temperature sensor directly into the device is mechanically challenging.
Innovation Solution
Integrating a temperature sensor into a fill-level measuring device element in thermal contact with the medium, such as within the bolt or ceramic element of the driver/receiver unit, allowing unimpeded oscillations and eliminating the need for additional components or connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate temperature sensor is introduced via a separate process connection, then temperature measurement capability is added, but costs increase and sealing risks increase
Solution Approach 1:
The temperature sensor is integrated into the existing fill-level measuring device by incorporating it into the driver/receiver unit structure. The sensor is mounted within the housing and thermally coupled to the membrane or housing wall, allowing temperature measurement without requiring additional process connections. This merging of functions eliminates the need for separate temperature measurement equipment and reduces overall system complexity.
Solution Approach 2:
The driver/receiver unit housing is designed to serve multiple functions: it houses the piezoelectric elements for oscillation generation, provides structural support for the membrane mounting, and incorporates the temperature sensor with thermal coupling to the process medium. This multi-functional design allows a single component to perform measurement, actuation, and temperature monitoring functions.
2Adaptability or versatility
If the temperature sensor is mounted on the housing wall, then temperature measurement is enabled, but it creates an impediment to screwing the pressure screw unit
Solution Approach 1:
The temperature sensor is nested within the driver/receiver unit housing structure, specifically positioned in a recess or designated mounting area that does not interfere with the pressure screw unit assembly. The sensor is thermally coupled to the housing wall or membrane through conductive pathways integrated into the existing structure, allowing it to measure process temperature without protruding into the assembly path of the pressure screw.
Solution Approach 2:
The temperature sensor is positioned in a different spatial dimension or orientation within the housing that avoids conflict with the pressure screw unit assembly path. By utilizing the three-dimensional space within the housing effectively, the sensor can be mounted on the housing wall or internal surfaces without creating impediments to the screwing operation, thereby resolving the spatial conflict between temperature measurement and assembly ease.
3Measurement precision
If the temperature sensor is mounted directly on the membrane or oscillatory fork, then temperature measurement is achieved, but the oscillatory system is negatively affected
Solution Approach 1:
The temperature sensor is mounted on the housing wall or internal structure that is in thermal contact with the process medium, rather than directly on the membrane or oscillatory fork. The housing wall acts as an intermediary that conducts heat from the process medium to the sensor without interfering with the mechanical oscillations. This indirect thermal coupling maintains measurement accuracy while preserving the integrity and functionality of the oscillatory system.
Solution Approach 2:
The temperature sensor is positioned in a specific location on the housing wall or driver/receiver unit structure where thermal coupling to the process medium is sufficient for accurate measurement, but where mechanical interference with the oscillatory system is avoided. By optimizing the sensor's local position and thermal pathway, the design achieves temperature measurement precision without compromising the dynamic performance of the oscillating components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature determination of the medium without degrading the oscillatory system, reducing costs and simplifying manufacturing by using existing device elements and minimizing additional components, while ensuring thermal contact and precise temperature measurement.
Implementation Method 1
a driver/receiver unit, which is composed of a plurality of piezoelectric elements arranged in a stack... excites the oscillatable unit via the membrane to execute oscillations
Implementation Method 2
the oscillatory system is covered by the measured medium, then the oscillation is attenuated... the resonance frequency has, however, a temperature dependence
Implementation Method 3
the temperature sensor is integrated in a fill-level measuring device element, which is in thermal contact with the medium via the membrane or the housing
Data Source
AI summary
A fill-level measuring device with a membrane, which is placed in such a manner on one of the two end region of a tubular housing that it seals the housing on such end region. An oscillatable unit is placed on the side of the membrane facing away from the housing, with a driver/receiver unit, which is composed of a plurality of piezoelectric elements arranged in a stack. The driver/receiver unit is placed via a pressure screw unit in such a manner in the housing that it oscillates in the direction of the longitudinal axis of the housing between the membrane and the pressure screw unit. The driver/receiver unit excites the oscillatable unit via the membrane to execute oscillations, with a control/evaluation unit, which evaluates amplitude, frequency and/or phase of the oscillations of the oscillatable unit and with a temperature sensor for determining temperature of the medium. The temperature sensor is integrated in a fill-level measuring device element, which is in thermal contact with the medium via the membrane or the housing, wherein the element is so selected that the oscillatable unit oscillates unimpaired by the temperature sensor.