Temperature Adjusting Member With Filled Through-Hole Adhesive
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Solution Overview
Problem
In temperature adjusting members, uneven adhesive flow into through-holes of the base body leads to differences in thermal conductivity, causing unstable temperature distribution on the attachment surface.
Innovation Solution
A temperature adjusting member design featuring a base body with a through-hole filled by a second adhesive part, along with a first adhesive layer between the base body and insulator substrate, and an optional first adhesion auxiliary layer to enhance bonding, ensuring consistent adhesive volume and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is applied between the base body and insulator substrate without filling the through-hole, then the bonding structure is simple, but the thermal conductivity becomes unstable due to uneven adhesive flow into the through-hole
Solution Approach 1:
The adhesive layer is segmented into two distinct parts: a first adhesive part positioned between the base body and insulator substrate for bonding, and a second adhesive part filling the through-hole of the base body. This segmentation ensures that each adhesive part serves a specific function, with the second part providing consistent thermal conductivity by completely filling the through-hole, thereby stabilizing temperature distribution while maintaining a manageable structural complexity.
2Manufacturing precision
If the through-hole is left empty or partially filled, then the manufacturing process is simpler, but the thermal conductivity varies due to incomplete adhesive filling
Solution Approach 1:
The through-hole of the base body is pre-filled with the second adhesive part before bonding the insulator substrate. This preliminary action ensures that the through-hole is completely filled with adhesive, providing consistent and stable thermal conductivity. By performing the filling action in advance, the manufacturing process achieves precise adhesive volume consistency without complicating the overall assembly process.
3Temperature
If adhesive flows unevenly into the through-hole, then the bonding is achieved, but the thermal conductivity becomes non-uniform causing temperature distribution differences
Solution Approach 1:
The second adhesive part is specifically positioned to fill the through-hole of the base body, providing localized high-quality adhesive placement where thermal conductivity is most critical. This local quality approach ensures uniform adhesive volume within the through-hole, which directly improves temperature distribution uniformity on the attachment surface, while the first adhesive part handles the general bonding requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the temperature distribution on the attachment surface by ensuring a consistent adhesive volume in the through-hole, reducing thermal conductivity variations and enhancing the reliability of temperature adjustments.
Implementation Method 1
The adhesive layer has a first part between the base body and the insulator substrate, and a second part filling the through-hole... improving stability of the temperature distribution
Data Source
AI summary
A temperature adjusting member includes a base body, an insulator substrate including a built-in heat-generating element and an opening portion through which a part of the heat-generating element is exposed, an electric wire connected to the heat-generating element through the opening portion, and an adhesive layer bonding the base body and the insulator substrate. The base body includes a through-hole connecting to the opening portion, through which the electric wire passes. The adhesive layer has a first part between the base body and the insulator substrate, and a second part filling the through-hole.