Filled Via Electrical Connector Thermal Management

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Solution Overview

Problem

Conventional electrical connectors face challenges in miniaturization, high-speed signal integrity, power handling, heat dissipation, and corrosion resistance, while being costly and susceptible to environmental damage due to their size and material limitations.

Innovation Solution

The electrical connector features filled vias with thermosetting epoxy or other materials to enhance mechanical strength, thermal conductivity, and electrical conductivity, reducing precious metal usage and providing a sealed environment to protect against moisture and corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If conventional electrical connectors are used with traditional plating methods, then electrical conductivity is achieved, but precious metal usage is excessive and cost is high

Engineering Contradiction:

Improveprecious metal usageVSAvoidcorrosion resistance

Core Design Contradiction:

Loss of substanceVSReliability

Solution Approach 1:

The patent applies different material properties to different regions: the via walls receive conductive plating for electrical connectivity, while the via core is filled with non-conductive epoxy for mechanical strength and corrosion protection. This localized differentiation reduces precious metal usage while maintaining reliability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The connector combines multiple materials with complementary properties: conductive plating (copper, nickel, gold) for electrical conductivity, and non-conductive epoxy filler for mechanical support and environmental protection. This composite approach optimizes both cost and performance.

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If connector size is reduced for miniaturization, then device size decreases, but heat dissipation capability deteriorates

Engineering Contradiction:

Improveconnector sizeVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent modifies the via structure by filling the core with epoxy material, which changes the thermal parameters of the connector. The epoxy provides thermal pathways that facilitate heat dissipation even in miniaturized connectors, addressing the heat management challenge in small form factors.

Inventive Principle:

Principle #35Parameter changes

3Volume of moving object

If connector size is reduced, then space utilization improves, but manufacturing complexity increases

Engineering Contradiction:

Improveconnector sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The via filling with epoxy is performed during the manufacturing process before final assembly, integrating the filling step into the existing production workflow. This preliminary action simplifies the overall manufacturing process despite the added material step.

Inventive Principle:

Principle #10Preliminary action

4Productivity

If electrical interconnections are increased for higher functionality, then signal handling capability improves, but susceptibility to environmental damage increases

Engineering Contradiction:

Improvesignal handling capabilityVSAvoidenvironmental susceptibility

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The epoxy filler acts as a protective shell within the via structure, sealing the conductive plating from environmental exposure. This protective barrier prevents moisture and corrosive agents from reaching the electrical interconnections, even as the number of interconnections increases.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables smaller, more reliable interconnections with improved signal integrity, increased current carrying capacity, and reduced heat retention, while minimizing precious metal usage and protecting against environmental damage, resulting in a cost-effective and durable connector.

Implementation Method 1

filled with a material such as thermosetting epoxy

Methodology Applied

Scientific EffectThermosetting:

Implementation Method 2

improved thermal dissipation

Methodology Applied

Scientific EffectThermal conductivity: Conduction (thermal)

Implementation Method 3

increased current carrying capacity

Methodology Applied

Scientific EffectElectrical conductivity: Conduction (electrical)

Data Source

PatentUS8641428B2Electrical connector and method of making it

Publication Date: 2014.02.04 NEOCONIX INC

AI summary

The present invention is an electrical connector in which a substrate (such as a printed circuit board or PCB) includes a plurality of apertures (or vias) and some of those apertures are filled with two materials to improve the characteristics of the electrical interconnection. The preferred process of crating the filled vias includes the steps of plating the vias with an electrically-conductive material to create an electrically-conductive path between portions of the substrate and components associated with the substrate and partially filling the apertures, then filling at least a portion of the apertures or vias with a second or different filling material to seal at least apart of the electrically conductive path through the plating. The second filling material may be chosen to provide thermal compensation for the connection.