Filled Via-Hole Display Substrate for Low-Stress Bonding
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Solution Overview
Problem
Micro-LED display substrates face damage due to stress concentration during the bonding process, primarily at via holes where electrical connections are made, leading to potential failures in the bonding process.
Innovation Solution
A display substrate design that includes a filling structure within the via holes to distribute pressure evenly, reducing stress concentration, and additional layers such as barrier and buffer layers to enhance structural integrity and flatness, ensuring a distance difference between the filling structure and the base substrate is within a preset threshold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via holes are created in the organic layer for electrical connection, then electrical connectivity is achieved, but stress concentration occurs during bonding process
Solution Approach 1:
A filling structure is formed in advance within the via hole to provide mechanical support and distribute stress during the bonding process. The filling structure acts as a cushion that prevents stress concentration at the via hole location, thereby protecting the substrate while maintaining electrical connectivity through the via hole.
2Reliability
If via holes are formed in the organic layer, then electrical connection is enabled, but flatness of subsequent film layers deteriorates
Solution Approach 1:
The filling structure is formed beforehand in the via hole to provide a flat support surface. This pre-formed filling structure enables subsequent film layers to be deposited uniformly without conforming to the via hole geometry, thereby maintaining flatness and manufacturing precision while still allowing electrical connection through the via hole.
3Reliability
If via holes are created for bonding connection, then electrical connectivity is achieved, but complexity of masking and etching processes increases
Solution Approach 1:
The formation of the filling structure is merged with the via hole formation process. The filling structure is created as part of the via hole fabrication sequence, combining multiple functions (electrical connection and stress distribution) into a single integrated structure, thereby reducing the need for separate masking and etching steps.
Data Source
AI summary
A display substrate includes a base substrate, a first conductive pattern, an organic layer and a second conductive layer. A via hole penetrating the organic layer is arranged in the organic layer along a direction perpendicular to the base substrate, a position of the via hole corresponds to a position of the first conductive pattern, and the second conductive layer is electrically connected to the first conductive pattern through the via hole. The display substrate further includes a filling structure for filling the via hole, a distance difference between a distance from a surface of the filling structure on a side away from the base substrate to the base substrate and a distance from a surface of the organic layer on a side away from the base substrate to the base substrate is smaller than a preset threshold.