Filler Cell Reinforcement for Low-Resistance Semiconductor Power Rails
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As integrated circuits become more densely packed, the reduced width of power rails leads to increased resistance and power loss, causing voltage drops and potential malfunctions in semiconductor devices.
Innovation Solution
Incorporating filler cells with reinforcement patterns that are electrically connected to power rails at multiple points to increase the cross-sectional area of the power rail, thereby reducing resistance and mitigating voltage drops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the degree of integration of the integrated circuit is increased by reducing cell height, then the integration density is improved, but the width of the power rail is reduced and resistance increases
Solution Approach 1:
The power delivery network is segmented into multiple independent power rails extending in the first direction, with each power rail serving specific logic cells. Filler cells are strategically positioned between logic cells to provide additional power distribution pathways, effectively dividing the power delivery function across multiple segments to reduce resistance in each individual rail.
Solution Approach 2:
Power rails are configured to extend in the first direction (length dimension) rather than relying solely on width increases. The filler cells introduce an additional spatial dimension for power distribution by positioning conductive patterns between existing logic cells, creating a three-dimensional power delivery architecture that compensates for reduced rail width without increasing overall device footprint.
2Area of stationary object
If the width of the power rail is reduced to accommodate higher integration, then the area occupied is reduced, but power loss due to voltage drop increases
Solution Approach 1:
Multiple power rails are merged in parallel to collectively supply power to logic cells. The filler cells are merged into the power distribution network as additional conductive pathways, combining their conductive patterns with the main power rails to create multiple current paths that reduce overall power loss while maintaining compact area utilization.
Solution Approach 2:
Filler cells act as intermediary structures between logic cells, providing additional power distribution pathways. The conductive patterns within filler cells serve as mediator elements that connect power rails at multiple distinct points, facilitating alternative current paths that reduce voltage drops and power loss in the power delivery network.
3Reliability
If filler cells with reinforcement patterns are added to increase power rail cross-sectional area, then resistance is reduced, but device complexity increases
Solution Approach 1:
Filler cells are designed with multi-functionality, serving both as structural fillers to maintain layout regularity and as active power distribution elements. The conductive patterns within filler cells perform dual roles: providing mechanical support/maintaining design rule compliance while simultaneously acting as additional power rails to reduce resistance and power loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces power loss and prevents device malfunctions by ensuring uniform power supply to elements in high-integration semiconductor devices.
Implementation Method 1
the reduced width of power rails leads to increased resistance and power loss
Data Source
AI summary
A semiconductor device includes a plurality of logic cells disposed in a first direction, a plurality of filler cells disposed in the first direction, and a power rail configured to apply a voltage to the logic cells and the filler cells, wherein the power rail extending in the first direction and electrically connected to the plurality of logic cells, and a reinforcement pattern disposed in at least one of the plurality of filler cells and electrically connected to the power rail, wherein the reinforcement pattern is electrically connected to the power rail at a plurality of distinct points.