Filler-Embedded Semiconductor Structure for Heat and Contact Reliability
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Solution Overview
Problem
Semiconductor devices, particularly optoelectronic components, face challenges with wire contact damage during handling and inadequate heat dissipation, despite encapsulation methods and conventional cooling techniques.
Innovation Solution
A semiconductor device design featuring a filler material surrounding the component with a layered, corrugated structure or undercut through-plating and further contact, enhancing mechanical stability and heat dissipation by allowing better electrical connectivity and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire contacts are used for electrical connections, then ease of manufacture is improved, but reliability deteriorates due to susceptibility to damage during handling and use
Solution Approach 1:
The patent extracts the vulnerable wire contacts from the device structure and replaces them with robust planar conductor tracks integrated into the substrate. This eliminates the protruding wire elements that are prone to mechanical damage during handling while maintaining electrical connectivity functions.
Solution Approach 2:
The patent introduces an intermediary encapsulation structure that integrates both mechanical protection and electrical connection functions. The conductor tracks are embedded within the substrate material, serving as an intermediary between the external environment and the internal electronic components, thereby protecting against damage while enabling electrical connections.
2Reliability
If conventional encapsulation methods are used, then protection against damage is improved, but heat dissipation deteriorates due to insufficient thermal management
Solution Approach 1:
The patent segments the encapsulation structure into distinct functional zones: a protective outer encapsulation layer and an integrated thermal management system with dedicated heat dissipation paths. This segmentation allows simultaneous optimization of mechanical protection and thermal performance through specialized material selection and structural design in each zone.
Solution Approach 2:
The patent creates a multi-functional encapsulation structure that simultaneously provides mechanical protection, electrical insulation, and thermal management. The encapsulation material and conductor track system serve multiple functions: protecting internal components, providing electrical connections, and facilitating heat dissipation through thermally conductive pathways integrated into the same structure.
3Ease of manufacture
If cooling via bottom side is used, then ease of manufacture is improved, but heat dissipation deteriorates because optimal heat dissipation from top side is not guaranteed
Solution Approach 1:
The patent transitions from unidirectional bottom-side cooling to a multi-dimensional thermal management approach. Heat dissipation pathways are established in multiple directions: through the bottom side via the substrate, laterally through conductor tracks on the surface, and potentially through side surfaces. This dimensional expansion of thermal pathways enables effective heat removal from the top side heat sources while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved mechanical stability and efficient heat dissipation for semiconductor devices, reducing the risk of wire contact damage and enhancing performance and efficiency.
Implementation Method 1
at least one conductor track is arranged on a top side of the filler material, which is electrically connected to the first electrical contact surface. A first and a second connection point are further arranged adjacent to an bottom side of the filler material opposite the top side of the filler material, the first connection point being electrically connected to the at least one conductor track via a through-plating through the filler material
Implementation Method 2
The through-plating comprises a layered structure, in particular forming a corrugated structure, and/or at least one undercut to fix the filler material
Data Source
AI summary
In an embodiment a semiconductor device includes a semiconductor component having a first electrical contact surface on a top side and a second electrical contact surface opposite the top side, a filler material enclosing the semiconductor component as seen in a circumferential direction, the filler material covering at least a partial region of a side surface of the component connecting the top side and the bottom side, at least one conductor track arranged on a top side of the filler material, the at least one conductor track being electrically connected to the first electrical contact surface and a first connection point and a second connection point arranged adjacent to a bottom side of the filler material opposite the top side of the filler material, the first connection point being electrically connected to the at least one conductor track via a through-plating through the filler material and the second connection point being electrically connected to the second electrical contact surface.