Filler-containing film for anisotropic conductive bonding
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Solution Overview
Problem
The relationship between the density of conductive particles in anisotropic conductive films and the thrust required for thermocompression bonding has not been adequately examined, leading to increased thrust requirements that can be difficult to manage with conventional pressing jigs, potentially increasing costs.
Innovation Solution
Adjusting the ratio of particle diameter to layer thickness and increasing the proportion of non-contacting fillers in a regular dispersion within the resin layer to reduce the thrust needed for bonding, while maintaining effective conductive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the density of conductive particles in the anisotropic conductive film is increased to improve connection reliability and suppress short circuit, then the conductive particle capturing properties at the terminal are enhanced, but the thrust required for the pressing jig to press the conductive particles into the terminal is increased
Solution Approach 1:
The invention changes the physical parameters of the conductive particles by controlling their size distribution and using a specific size range (0.1-10 μm). This parameter optimization allows sufficient particle capturing at terminals while reducing the overall thrust requirement, as smaller particles require less force to be pressed into contact.
Solution Approach 2:
The invention creates local quality variations by having conductive particles with different sizes distributed throughout the resin layer. Particles of optimal size are positioned to be easily captured by terminals where connection is needed, while the overall distribution maintains adequate spacing. This local optimization ensures reliable connection without requiring excessive thrust across the entire film.
2Reliability
If the density of conductive particles is increased to ensure connection reliability, then the conductive properties are improved, but the conventional pressing jig cannot cope with the increased thrust requirement
Solution Approach 1:
By optimizing the particle size parameters to be within 0.1-10 μm and controlling the area occupancy rate to 5-30%, the invention changes the mechanical interaction parameters between particles and pressing jig. This allows conventional pressing jigs to operate within their designed thrust capacity while still achieving reliable connections through the optimized particle distribution and size characteristics.
3Reliability
If the area occupancy rate of fillers is increased to improve conductive properties, then more conductive particles are available for connection, but the thrust required for bonding increases
Solution Approach 1:
The invention optimizes the area occupancy rate parameter to a specific range of 5-30%, which balances the number of conductive particles available for connection with the thrust required to bond them. This parameter optimization ensures sufficient conductive properties while keeping the bonding thrust within manageable limits for conventional equipment.
Solution Approach 2:
The invention applies local quality by having conductive particles distributed non-uniformly with varying sizes throughout the resin layer. This distribution ensures that particles are positioned optimally for terminal capture while maintaining adequate spacing, achieving good conductive properties without requiring excessive thrust for bonding all particles simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved conductive particle capture and reduced thrust requirements, ensuring reliable connections with lower pressure and maintaining the arrangement of fillers during bonding.
Implementation Method 1
by regularly dispersing the filler, by increasing the proportion by number of the fillers present in a non-contact state with each other
Implementation Method 2
when thermocompression bonding of an anisotropic conductive film to an electronic component using a pressing jig is conventionally performed
Implementation Method 3
enhance the conductive particle capturing properties at the terminal to thereby improve the conduction characteristics
Data Source
AI summary
A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.