Filler Layer Forming Method for Semiconductor Substrates
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Solution Overview
Problem
During the manufacturing of semiconductor substrates, the use of filler solutions with low viscosity and high surface tension can cause deformation of pattern elements due to surface tension effects and centrifugal forces during the drying process, especially when high-speed rotation is employed to reduce the filler layer thickness.
Innovation Solution
Applying a filler solution with a viscosity of 3 centipoises or more and rotating the substrate at 1000 revolutions per minute or less to form a solution layer of predetermined thickness, which reduces the occurrence of voids and deformation by enhancing adhesion and controlling centrifugal forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a filler solution with low viscosity is used to allow filler diffusion into spaces between pattern elements, then filling effectiveness is improved, but pattern element deformation occurs due to surface tension and centrifugal forces
Solution Approach 1:
The patent changes the viscosity parameter of the filler solution from low (conventional) to specifically 3 centipoises or more. This parameter modification allows the solution to maintain adequate flow for filling while providing sufficient resistance against surface tension and centrifugal forces during rotation, thereby preventing pattern element deformation.
2Productivity
If substrates are rotated at high speed (e.g., 1500 rpm) to reduce filler layer thickness and improve throughput, then productivity is improved, but pattern element deformation increases
Solution Approach 1:
The patent applies preliminary anti-action by using a filler solution with viscosity of 3 centipoises or more before rotation occurs. This pre-established viscous resistance counteracts the centrifugal forces that will act during high-speed rotation, allowing the process to maintain both high throughput and pattern element integrity.
3Reliability
If a water-based polymer solution with high surface tension is used as filler solution, then safety and ease of maintenance are improved, but pattern element deformation is more evident
Solution Approach 1:
The patent modifies the viscosity parameter of water-based polymer solutions to 3 centipoises or more. This change maintains the safety and ease of maintenance advantages of water-based solutions while providing sufficient viscous resistance to counteract the high surface tension effects that cause pattern element deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses deformation of pattern elements by ensuring adequate adhesion and reducing void formation in the filler layer, thereby maintaining the integrity of the substrate patterns during the filling process.
Implementation Method 1
replacing a processing liquid that adheres to an entirety of the main surface with the filler solution and forming a solution layer
Implementation Method 2
forming a solution layer of a predetermined thickness by rotating the substrate at V revolutions per minute or less
Data Source
AI summary
A large number of pattern elements stands upright on an upper surface of a substrate. After the upper surface of the substrate has been processed using a processing liquid, liquid filling processing for filling the upper surface with a filler solution is performed, in which the filler solution having a viscosity of three centipoises or more is applied to a central part of the upper surface. Then, by rotating the substrate at 1000 revolutions per minute or less, the processing solution adhering to the entire upper surface is replaced by the filler solution, and a solution layer of a predetermined thickness is formed. In this way, making the viscosity of the filler solution relatively high and making the centrifugal force acting at the time of rotating the substrate relatively low suppresses deformation of the pattern elements at the time of filling with a filler that uses the filler solution.