Filler Layer Convex Top Surface for OLED Sealant Sealing
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Solution Overview
Problem
The existing packaging processes for OLED display panels are prone to gaps between the sealant and cover plate, allowing external air and water vapor to enter, which reduces the lifespan and anti-shock ability of the panels.
Innovation Solution
A filler layer is introduced under the sealant, forming a convex-shaped top surface that ensures tight contact with the cover plate during the sintering and laser sealing processes, using materials like Ti or Ti alloy with a matching thermal expansion coefficient, and optionally a heat dissipation layer to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional sintering process is used to form the sealant, then the sealant can be formed between the substrate and cover plate, but the top surface of the sealant becomes concave-shaped creating gaps that reduce sealing effectiveness
Solution Approach 1:
A filler layer is deposited on the substrate before applying the sealant. This preliminary action creates a compensating structure that prevents the sealant surface from becoming concave during sintering, ensuring the top surface remains substantially flat for effective sealing with the cover plate.
Solution Approach 2:
The thermal expansion coefficient of the filler layer is designed to be substantially consistent with that of the sealant. This parameter matching ensures that both materials expand and contract uniformly during temperature changes, preventing differential expansion that would cause the sealant surface to deform and create gaps.
2Ease of manufacture
If gaps are present between the sealant and cover plate, then the packaging structure is easier to manufacture, but external air and water vapor can enter the display panel reducing its lifespan
Solution Approach 1:
The filler layer is deposited in advance to create a protruding structure that compensates for sealant shrinkage during sintering. This preliminary preparation ensures that the sealant maintains a substantially flat top surface that makes tight contact with the cover plate, eliminating gaps that would allow moisture ingress.
Solution Approach 2:
By matching the thermal expansion coefficient of the filler layer with that of the sealant, the invention ensures uniform thermal behavior during processing and operation. This prevents differential expansion/contraction that would create gaps between the sealant and cover plate, maintaining reliable sealing while preserving manufacturing simplicity.
3Ease of manufacture
If the thermal expansion coefficients of the filler layer and sealant are mismatched, then easier materials can be selected, but thermal stress during sintering and operation can cause delamination or cracking
Solution Approach 1:
The invention specifies that the thermal expansion coefficient of the filler layer should be substantially consistent with that of the sealant. This parameter matching minimizes thermal stress during sintering and operational temperature variations, preventing delamination or cracking while maintaining strong adhesion between the filler layer and sealant.
Solution Approach 2:
The invention uses a composite structure consisting of the filler layer and sealant. By carefully selecting materials whose thermal expansion coefficients are substantially consistent with each other, the composite structure achieves thermal compatibility, preventing internal stresses that would compromise the adhesion and overall strength of the packaging structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the adhesion force between the sealant and cover plate, preventing external moisture ingress and increasing the display panel's lifespan while improving its anti-shock resistance.
Implementation Method 1
sintering, and coupling and laser sealing
Implementation Method 2
the thermal expansion coefficient of the filler layer is substantially consistent with the thermal expansion coefficient of the sealant
Implementation Method 3
a heat dissipation layer is formed between the substrate and the sealant, and the filler layer is disposed between the sealant and the heat dissipation layer
Data Source
AI summary
A display panel. The display panel may include a substrate having a display region and a non-display region; a cover plate; a sealant between the substrate and the cover plate; and a filler layer covered by the sealant to cause the sealant to have tight contact with the substrate and with the cover plate. The sealant may be in the non-display region for bonding the substrate and the cover plate.