Inorganic Filler-Metal Laminate for Heat Dissipation and Adhesion
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Solution Overview
Problem
Current materials used in electronic equipment packages face challenges in achieving high thermal conductivity and interlayer adhesion, leading to issues such as excessive temperature rise and reduced service life due to thermal strain caused by material expansion differences.
Innovation Solution
A laminate composed of an inorganic filler layer and a metal layer, bonded using a coupling agent or a bifunctional polymerizable compound, which enhances thermal conductivity and interlayer adhesion, allowing for efficient heat dissipation and reduced thermal expansion mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional materials are used in package, then manufacturing is simpler, but thermal conductivity is insufficient leading to excessive temperature rise
Solution Approach 1:
The patent uses a composite material consisting of inorganic filler particles (such as aluminum nitride, aluminum oxide, or boron nitride) dispersed in a polymer matrix. This composite structure combines the high thermal conductivity of inorganic materials with the processability of polymers, achieving both improved heat dissipation and ease of manufacture. The inorganic filler provides thermal conduction pathways while the polymer binder holds the structure together and allows for conventional manufacturing processes.
2Temperature
If materials with different thermal expansion coefficients are used, then thermal conductivity can be improved, but thermal strain causes peeling and delamination
Solution Approach 1:
The patent carefully selects and adjusts the thermal expansion coefficient of the composite material by controlling the type, amount, and distribution of inorganic filler particles. By optimizing these parameters, the thermal expansion coefficient of the package material is matched to the semiconductor chip and other components, reducing thermal strain during temperature cycling. This parameter optimization allows the material to maintain both high thermal conductivity and dimensional stability, preventing peeling and delamination while efficiently dissipating heat.
3Temperature
If high thermal conductive materials are used, then heat dissipation is improved, but interlayer adhesion is reduced
Solution Approach 1:
The patent employs a composite structure where inorganic filler particles providing high thermal conductivity are embedded in a polymer matrix that ensures good adhesion. The polymer component acts as a bonding agent between layers while the inorganic particles create thermal conduction pathways. This composite approach allows the material to simultaneously achieve high heat dissipation capability through the inorganic filler and strong interlayer adhesion through the polymer matrix, resolving the contradiction between thermal performance and bonding strength.
4Temperature
If complex production methods are used, then material performance can be improved, but production steps increase
Solution Approach 1:
The patent incorporates inorganic filler particles into the polymer matrix in advance during material preparation, creating a pre-formulated composite material that can be directly processed. This preliminary mixing and distribution of filler particles ensures uniform thermal conductivity throughout the final product without requiring complex post-processing steps. The composite material can be molded and processed using conventional techniques, maintaining high thermal conductivity performance while simplifying the production process and improving manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate exhibits high thermal conductivity in both horizontal and thickness directions, along with excellent interlayer adhesion, chemical stability, and mechanical strength, making it suitable for heat-dissipating applications while simplifying the production process.
Implementation Method 1
connecting a layer to be formed of an inorganic filler and the metal layer through a coupling agent
Implementation Method 2
heat generated inside electronic equipment can be efficiently conducted and transferred, whereby heat can be dissipated
Implementation Method 3
a bifunctional or higher functional polymerizable compound
Data Source
AI summary
The present application relates to a laminate between an inorganic substance and metal, which is excellent in thermal conductivity and interlayer adhesion. The laminate of the present application has a thermally conductive first inorganic filler bonded with one end of first coupling agent 11; and a metal layer bonded with one end of a third coupling agent, in which the other end of the third coupling agent is bonded with the other end of the first coupling agent. The laminate has such a bond between the inorganic filler and the metal layer through an organic compound, whereby the laminate may be excellent in thermal conductivity and interlayer adhesion.