Thermally Conductive Sheet With Tuned Filler Size for Formability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional thermally conductive compositions and sheets suffer from high thermal conductivity leading to increased plasticity and reduced formability due to the need for high amounts of thermally conductive particles.
Innovation Solution
A thermally conductive composition comprising specific types and sizes of alumina and aluminum nitride particles, combined with a matrix resin and a curing catalyst, which is defoamed, rolled, and heat-cured to form a sheet with high thermal conductivity and low plasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of thermally conductive particles is added to increase thermal conductivity, then thermal conductivity is improved, but the degree of plasticity increases and formability deteriorates
Solution Approach 1:
The patent applies parameter changes by precisely controlling the particle size distribution parameters (D10, D50, D90 values) and size ratio parameters of thermally conductive particles. By optimizing these parameters, the invention achieves high thermal conductivity with reduced particle content, thereby maintaining low plasticity and good formability. This resolves the contradiction by changing the size distribution parameters rather than simply increasing particle amount.
Solution Approach 2:
The patent uses composite materials by combining thermally conductive particles with specific resin matrices and adding coupling agents. This composite structure improves thermal conductivity efficiency, allowing lower particle loading while achieving target thermal performance. The composite approach reduces the need for excessive particle addition, thus maintaining formability while improving thermal conductivity.
2Temperature
If a large amount of thermally conductive particles is added to increase thermal conductivity, then thermal conductivity is improved, but plasticity increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the particle size distribution parameters (D10, D50, D90 values) and size ratio parameters of thermally conductive particles. By optimizing these parameters, the invention achieves high thermal conductivity with reduced particle content, thereby maintaining low plasticity and good formability. This resolves the contradiction by changing the size distribution parameters rather than simply increasing particle amount.
3Temperature
If high thermal conductivity is achieved, then heat dissipation performance is improved, but adhesion and formability deteriorate
Solution Approach 1:
The patent optimizes particle size distribution parameters to achieve efficient thermal conduction with lower particle loading, reducing the negative impact on adhesion. The coupling agent further enhances interfacial adhesion between particles and matrix, resolving the contradiction between heat dissipation performance and adhesion strength.
Solution Approach 2:
The patent introduces coupling agents as intermediary substances between thermally conductive particles and the resin matrix. These coupling agents improve interfacial adhesion and stress transfer, counteracting the adhesion deterioration caused by high particle content. This mediator approach allows high thermal conductivity while maintaining good adhesion properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high thermal conductivity (14 W/m·K or more) with low plasticity and good formability, enabling continuous sheet formation and excellent adhesion to heat-generating components.
Implementation Method 1
a thermally conductive composition suitable to be interposed between a heat generating member and a heat dissipator
Implementation Method 2
a matrix resin as component A, constituted by a thermosetting resin, a curing catalyst
Data Source
AI summary
A thermally conductive composition includes a matrix resin (component A) containing a thermosetting resin, a curing catalyst, and thermally conductive particles including components B and C, the component B being alumina having a D50 (median diameter) of 0.01 μm or more and less than 1 μm in a volume-based cumulative particle size distribution, contained in an amount of 220 to 500 parts by mass relative to 100 parts by mass of the matrix resin, and the component C being aluminum nitride having a D50 of 0.01 μm to 150 μm, contained in an amount of 1900 to 2500 parts by mass relative to 100 parts by mass of the matrix resin. This configuration provides a thermally conductive composition having a high thermal conductivity, a low degree of plasticity, and good formability, a thermally conductive sheet using the thermally conductive composition, and a method for producing the sheet.