Filling Component Module for Server Rack Cooling Liquid Reduction
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Solution Overview
Problem
Conventional electronic devices in server racks require a large amount of cooling liquid to fill the gap between the device and the cooling slot, increasing costs due to the volume of cooling liquid needed.
Innovation Solution
An electronic device with a filling component module disposed on the exterior of the shelf casing, adjacent to the side walls, which reduces the gap between the device and the cooling slot, thereby minimizing the volume and cost of the cooling liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the conventional electronic device is disposed within the server rack with a large gap between the device and cooling slot, then the device can be easily installed and maintained, but the volume and cost of cooling liquid required increases significantly
Solution Approach 1:
The filling component is divided into multiple segments corresponding to different gaps between the electronic device and cooling slot. Each segment can be independently adjusted or removed, allowing flexible adaptation to different installation scenarios while maintaining optimal cooling liquid volume.
Solution Approach 2:
The filling component is designed with adjustable characteristics, allowing it to be dynamically configured based on the specific gap dimensions. This enables the system to adapt between providing sufficient filling for cooling liquid reduction and maintaining accessibility for installation and maintenance operations.
2Quantity of substance
If the gap between the electronic device and cooling slot is reduced using a filling component, then the volume and cost of cooling liquid is reduced, but the device complexity increases
Solution Approach 1:
The filling component utilizes flexible material structures that can conform to the gap space between the electronic device and cooling slot. This flexible design effectively reduces the gap volume without requiring complex rigid mechanical structures, thereby minimizing the added complexity.
Solution Approach 2:
The filling component is designed as a simple, cost-effective element that can be easily replaced if needed. This approach minimizes the complexity burden by using straightforward structures rather than complex, expensive components requiring precise manufacturing and assembly.
3Quantity of substance
If the filling component module is disposed on the exterior of the shelf casing, then the gap filling effectiveness is improved, but the device exterior complexity increases
Solution Approach 1:
The filling component module is merged with the shelf casing structure, forming an integrated assembly. This combination allows the filling function to be achieved without adding separate, complex external components, as the filling element becomes part of the existing shelf structure.
Solution Approach 2:
The shelf casing structure is designed to serve multiple functions: it provides mechanical support for the electronic device, defines the mounting position, and incorporates the filling component for gap filling. This multi-functionality reduces the need for additional dedicated filling structures, thereby limiting exterior complexity increase.
Data Source
AI summary
An electronic device and a power system are provided. The electronic device includes a shelf casing and a filling component module. The shelf casing includes a plurality of side walls disposed around in sequence. The filling component module is disposed on the exterior of the shelf casing and adjacent to at least one of the plurality of side walls.