Filling Device for Electrochemical Deposition with Feedback Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the electrochemical deposition process for manufacturing display products, maintaining the ion balance in the electrolyte solution is challenging due to the gradual decrease in metal ions, requiring accurate and timely supplementation of metal ions to ensure efficient deposition of thick metal film layers, such as copper, which is crucial for high current-carrying capacity applications like LED displays.
Innovation Solution
A filling device and method that includes a weighing system to detect the material weight and control the conveying speed of a spiral conveying structure to accurately deliver copper oxide powder into the electrochemical deposition system, ensuring the target concentration of copper ions is maintained by adjusting the conveying speed based on the detected weight, stopping when the target weight is reached, thereby maintaining ion balance and improving deposition efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If metal ions are supplemented continuously to maintain ion balance, then deposition efficiency is improved, but manufacturing precision deteriorates due to inaccurate material quantity control
Solution Approach 1:
The patent implements a feedback control system where a weighing device continuously monitors the weight of metal ion material in the container, and the control structure adjusts the conveying speed of the spiral conveying structure based on the weight difference from the target value. This closed-loop feedback mechanism ensures accurate material quantity control while maintaining continuous supplementation for efficient deposition.
Solution Approach 2:
The patent employs dynamic adjustment of the conveying speed according to the real-time weight detection. The control structure modifies the rotation speed of the spiral conveying structure based on the current material weight, transitioning from static fixed-speed conveying to dynamic variable-speed conveying, thereby achieving precise control over material supplementation quantity.
2Productivity
If conveying speed is increased to supplement metal ions faster, then productivity is improved, but manufacturing precision deteriorates due to difficulty in controlling exact material quantity
Solution Approach 1:
The system dynamically adjusts the conveying speed based on real-time weight feedback. When the material weight is below the target, the conveying speed increases to accelerate supplementation; when approaching the target weight, the speed decreases to enable precise stopping. This dynamic control resolves the contradiction between speed and precision.
Solution Approach 2:
The weighing device provides continuous feedback on material quantity, allowing the control structure to modulate the conveying speed accordingly. This feedback mechanism enables the system to achieve both fast supplementation and precise quantity control by adjusting speed based on the current state relative to the target weight.
3Manufacturing precision
If a weighing device and control system are added to control material weight, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The system employs self-service principles where the weighing device automatically monitors material weight and the control structure autonomously adjusts conveying speed without external intervention. This automation reduces the need for complex manual control mechanisms and external monitoring systems, thereby limiting the increase in overall device complexity despite adding weighing and control functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures precise control of metal ion concentration in the electrolyte solution, enhancing the efficiency and cost-effectiveness of the electrochemical deposition process by accurately supplementing metal ions, thus improving the quality and thickness of the metal film layers deposited on substrates.
Implementation Method 1
a spiral conveying structure disposed between the first discharge port and the second feed port, the spiral conveying structure being configured to convey a material output from the first discharge port to the second feed port
Implementation Method 2
a weighing means disposed on the container, the weighing means being configured to detect a weight of a material in the container
Implementation Method 3
The electrochemical deposition process refers to a process of obtaining a metal coating on a substrate through migration of positive and negative ions in an electrolyte solution containing metal ions under the action of an external electric field, and through reduction of metal ions at a cathode
Data Source
AI summary
The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.