Filling Microgaps in Mechatronic Housings with Elastic Fillers
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Solution Overview
Problem
Existing methods for encapsulating electronic components in housings often result in microgaps that can lead to moisture penetration, causing malfunction due to inadequate wetting between the component and the housing materials, especially in sensitive sensors.
Innovation Solution
A method involving the use of a fluid, non-hardening or elastic filler that is sucked into or pressed into microgaps via vacuum or pressure, ensuring complete filling and sealing, using openings in the housing, and selecting fillers with good wetting properties and impermeability to water.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the component is inserted into a pre-made housing with precise geometry matching, then the housing fits snugly against the component, but micro-gaps of a few micrometers or tenths of a millimeter still remain between the component and housing
Solution Approach 1:
The patent applies preliminary action by inserting a filler material into the micro-gaps between the component and housing before the component is fully enclosed. The filler is introduced through openings in the housing while the component is still accessible, allowing the gaps to be sealed in advance before final assembly completion.
Solution Approach 2:
The patent uses an intermediary filler material (such as silicone elastomer or wax) that mediates between the component and housing surfaces. This filler material flows into the micro-gaps and creates a reliable seal, acting as an intermediary substance that bridges the gap between two surfaces that cannot achieve perfect contact on their own.
2Adaptability or versatility
If elastic housing material is used to improve fit, then the housing conforms better to the component, but micro-gaps still persist due to insufficient adhesive bonding and wetting
Solution Approach 1:
The filler material serves as an intermediary that compensates for insufficient adhesive bonding and wetting between the elastic housing material and the component. Rather than relying solely on the adhesive properties of the elastic material, the filler is introduced to ensure complete gap filling and reliable sealing.
3Manufacturing precision
If overmolding with plastic material is used to enclose the component, then the housing geometry precisely matches the component, but micro-gaps remain due to lack of wetting between surfaces
Solution Approach 1:
The patent applies preliminary action by introducing the filler material into the micro-gaps created by overmolding before the housing is completely sealed. The filler is injected through openings in the overmolded housing while the component structure is still accessible, allowing gaps to be filled in advance.
Solution Approach 2:
The filler material acts as an intermediary substance that bridges the interface between the plastic housing and the component. Since the plastic housing and component surfaces do not wet each other sufficiently, the filler material (such as silicone elastomer or wax) serves as a mediating substance that flows into and seals the micro-gaps, preventing moisture penetration.
4Ease of manufacture
If micro-gaps are left between component and housing, then the component can be easily inserted, but moisture can penetrate through the gaps and cause sensor malfunction
Solution Approach 1:
The patent applies preliminary action by filling the micro-gaps with filler material before the housing is completely enclosed or before the component becomes inaccessible. The filler is introduced through openings in the housing while there is still time to ensure complete gap filling, thereby preventing future moisture penetration that would cause sensor malfunction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively seals microgaps, preventing moisture ingress and ensuring the electronic component's functionality by maintaining a sealed environment even under thermal changes, using suitable fillers like silicone elastomers or oils that remain elastic and impermeable.
Implementation Method 1
the micro gaps are filled with a fluid, non-curing or, in the cured state, elastic filler, which is drawn in through a first opening on the housing side by means of a negative pressure applied to a second opening on the housing side until the micro gap(s) are completely filled
Implementation Method 2
which is forced in by means of positive pressure at the first opening until the micro gap(s) are completely filled
Implementation Method 3
A filler that is impermeable to water molecules is particularly preferred, thus preventing water from penetrating, even if it were to diffuse through the housing for whatever reason
Implementation Method 4
the flanks of the annular groove sections of the molding compounds run against each other and seal... in the event of a thermally induced change in length
Data Source
AI summary
Method for manufacturing an electronic component, in particular a mechatronic component, comprising at least one electronic component (1) which is inserted into a housing (5), wherein one or more micro gaps (8) remain between the component (1) and the housing (5), wherein the micro gaps (8) are filled with a fluid, non-curing or, in the cured state, elastic filler (9), which is drawn in through a first opening (6) on the housing side by means of a vacuum applied to a second opening (7) on the housing side until the micro gap(s) (8) is completely filled, or which is forced in by means of overpressure at the first opening (6) to completely fill the micro gap(s) P (8).