Component Manufacturing Film With Additional Layer for Heated Chucking
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Solution Overview
Problem
Conventional methods for semiconductor component manufacturing require separate carriers for dicing, inspection, and pickup steps, leading to complexity and increased costs due to differing performance requirements, particularly in handling thermal and mechanical stretchability and heat resistance.
Innovation Solution
A component-manufacturing film with a base layer, adhesive layer, and additional layer, where the additional layer has a tensile elastic modulus equal to or greater than the base layer, enabling reliable chucking on a chuck table in heated environments and shared use across multiple steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a stretchable sheet with high mechanical stretchability is used to enable pickup step expansion, then the mechanical stretch amount is sufficient for pickup, but the thermal expansion amount becomes excessive causing displacement between inspection electrode pad and bump
Solution Approach 1:
The patent changes the material parameter by selecting a stretchable sheet with specific thermal expansion characteristics that balance mechanical stretchability and thermal expansion control, enabling the sheet to satisfy both pickup expansion requirements and inspection alignment requirements
Solution Approach 2:
The patent uses a composite structure consisting of a stretchable sheet combined with a rigid frame body, where the frame body provides thermal expansion reference and the stretchable sheet provides mechanical flexibility, creating a hybrid system that resolves the contradiction between thermal and mechanical requirements
2Reliability
If separate carriers are used for dicing, inspection, and pickup steps to meet different performance requirements, then each step can use optimized carrier, but the process becomes complicated and costs increase
Solution Approach 1:
The patent creates a multi-functional carrier system where the stretchable sheet combined with frame body can be used across dicing, inspection, and pickup steps, eliminating the need for separate carriers and reducing process complexity while maintaining performance requirements for each step
3Manufacturing precision
If thermal stretchability is used to eliminate displacement between inspection electrode pad and bump, then alignment is improved, but the stretch amount is insufficient for pickup step expansion
Solution Approach 1:
The patent changes the material parameters by selecting a stretchable sheet with specific elastic modulus and thermal expansion coefficient values that provide both sufficient thermal stretchability for alignment and adequate mechanical stretchability for pickup expansion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable chucking and inspection in heated environments without the need for carrier replacement, improving efficiency and productivity by allowing shared use of the carrier across dicing, inspection, and pickup steps.
Implementation Method 1
in a temperature range of 190°C or lower, a tensile elastic modulus of the additional layer is equal to a tensile elastic modulus of the base layer or more
Implementation Method 2
since a sheet excellent in mechanical stretchability has great thermal expansion amount, the thermal expansion amount of the stretchable sheet becomes excessive
Data Source
Figure 1(a)~2
Figure 3~4(b)
Figure 5(a)~5(b)
AI summary
For the purpose of providing a component-manufacturing film, a component-manufacturing tool, and a component-manufacturing method with which reliable chucking to a chuck table is possible in a heated environment while having a property of being commonly used in this field enabling shared use in different steps, the film 1 includes a first region S1 and a second region S2 disposed so as to surround the region S1; the region S1 is formed of a base layer 11 and an adhesive layer 12 provided on one surface side of the base layer 11; the region S2 is formed of the base layer 11, the adhesive layer 12, and an additional layer 13 affixed onto the layer 12. In the temperature range of 190°C or lower, a tensile elastic modulus of the additional layer 13 is equal to or greater than the tensile elastic modulus of the base layer 11. The present method includes: a component fixing step; a film placement step of performing placement so that the boundary between the region S1 and the region S2 is located inside with respect to an edge of the chuck table; a chucking step; and a heating step.