Film Forming Alignment Correction Using In-Situ Thickness Measurement

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Solution Overview

Problem

Conventional film forming systems require multiple substrates and complex operations to correct film forming position misalignment after replacing the shielding member, leading to reduced throughput and increased man-hours due to the need to unload substrates for measurement and repeated film formation processes.

Innovation Solution

A film forming system equipped with an in-situ film thickness measuring device that measures film thickness to detect and correct film forming position misalignment by adjusting the transfer mechanism, allowing for real-time measurement and correction without unloading the substrate, using the same substrate for multiple iterations of film formation and measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If substrate is unloaded for measurement and repeated film formation is performed to correct misalignment, then film forming position misalignment can be corrected, but throughput decreases and man-hours increase

Engineering Contradiction:

Improvefilm forming position alignmentVSAvoidthroughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the conventional mechanical approach of unloading substrates for external measurement with an in-situ film thickness measuring device that performs measurements directly within the film forming chamber. This substitution eliminates the need to unload substrates, maintain vacuum conditions repeatedly, and perform multiple film formation cycles, thereby resolving the contradiction between achieving precise alignment correction and maintaining high throughput

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The in-situ film thickness measuring device acts as an intermediary tool that enables precise measurement of film formation position without requiring substrate removal. This intermediary measurement capability allows for real-time detection and correction of misalignment while the substrate remains in the chamber, avoiding the productivity losses associated with repeated loading/unloading operations

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If multiple substrates are used for correction measurements, then accurate misalignment detection is achieved, but substrate consumption increases and operational complexity increases

Engineering Contradiction:

Improvemisalignment detection accuracyVSAvoidoperational complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The in-situ film thickness measuring device enables the substrate to serve itself for measurement purposes. The same substrate that receives the film deposition is also measured in-place to detect misalignment, eliminating the need to use multiple substrates or transfer substrates between different measurement and processing stations, thereby reducing operational complexity

Inventive Principle:

Principle #25Self-service

3Manufacturing precision

If conventional teaching method is used for transfer mechanism, then substrate transfer position can be controlled, but misalignment correction becomes complex when shielding member is replaced

Engineering Contradiction:

Improvesubstrate transfer positionVSAvoidcorrection process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent implements a feedback mechanism where the in-situ film thickness measuring device provides real-time measurement data about film formation position on the substrate. This feedback information is used to detect misalignment caused by shielding member replacement, and the transfer mechanism's teaching data is subsequently corrected based on this feedback, simplifying the correction process while maintaining high precision

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the correction process, reduces the number of substrates required, and enhances film forming rate by enabling in-situ measurement and correction, thereby improving operational efficiency and throughput.

Implementation Method 1

a film thickness measuring device for in-situ measuring a film thickness of the film formed in the film forming module

Methodology Applied

Scientific EffectFilm thickness measurement:

Data Source

PatentUS12180580B2Film forming position misalignment correction method and film forming system

Publication Date: 2024.12.31 TOKYO ELECTRON LTD

AI summary

There is provided a film forming position misalignment correction method comprising: replacing a shielding member; loading a substrate into a film forming module by a transfer mechanism and forming a film on the substrate; detecting an amount of film forming position misalignment by transferring the substrate on which the film has been formed to a film thickness measuring device; correcting a transfer position of the substrate for the transfer mechanism; and checking the correction by transferring the substrate used for measuring the amount of film forming position misalignment to the film forming module by the transfer mechanism for which the transfer position has been corrected to form a film and determining the amount of film forming position misalignment by measuring a film thickness of the formed film by the film thickness measuring device in the same manner.