Selective Film Formation Using Basic Rinsing Liquid
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Solution Overview
Problem
Existing methods for forming protective films on substrates during semiconductor production face challenges in achieving high selectivity and sufficient film thickness, particularly in the removal step using a rinsing liquid, which can reduce the selectivity of film formation.
Innovation Solution
A method involving coating a substrate with a composition containing a polymer with a structural unit represented by formula (1) and a solvent, followed by heating and subsequent removal with a rinsing liquid containing a basic compound, to form a film with a large thickness and high selectivity, where the polymer has a number average molecular weight of 13000 or more and specific structural units for enhanced adsorption and etching resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a polymer composition is coated and heated to form a protective film, then the film thickness can be increased, but the selectivity of film formation is reduced
Solution Approach 1:
The patent applies local quality by creating different functional regions within the polymer film. The film contains both adhesive regions (with carboxyl groups for substrate bonding) and non-adhesive regions (with hydrocarbon chains for release). This local differentiation allows the film to maintain high thickness while achieving selective adhesion only in specific areas, thus resolving the contradiction between film thickness and formation selectivity.
2Length of stationary object
If a polymer with high molecular weight is used to form a thick film, then the film thickness is sufficient, but the removal with rinsing liquid becomes difficult
Solution Approach 1:
The patent introduces local quality by creating distinct chemical regions within the polymer structure. The non-adhesive regions contain hydrocarbon chains that are selectively removable by basic rinsing liquids, while the adhesive regions with carboxyl groups remain intact. This allows thick films to be formed with high molecular weight polymers while maintaining ease of selective removal in specific areas.
Solution Approach 2:
The patent applies parameter changes by modifying the chemical composition parameters of the polymer. By incorporating specific functional groups (carboxyl groups at 0.1-10 mmol/g) and controlling the polymer structure, the film exhibits differential reactivity to basic rinsing liquids. This enables thick films to be removed selectively without requiring low molecular weight polymers, thus resolving the contradiction between film thickness and removability.
3Length of stationary object
If the polymer structure is optimized for strong adsorption, then the film thickness and protection are improved, but the selectivity of adsorption is reduced
Solution Approach 1:
The patent implements local quality by creating spatially separated functional regions within the polymer film. Carboxyl groups provide strong adsorption to substrate surfaces in adhesive regions, while hydrocarbon chain regions provide selective non-adhesion. This local differentiation enables the film to achieve both thick formation and high adsorption selectivity, as the strong adsorption occurs only in specific regions rather than uniformly across the entire film.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the convenient and highly selective formation of a film with a sufficiently large thickness, ensuring effective protection of specific substrate regions, even during etching treatments, by optimizing the interaction between the polymer and the substrate surface.
Implementation Method 1
optimizing the interaction between the polymer and the substrate surface
Implementation Method 2
heating the coating film
Implementation Method 3
removing, with a rinsing liquid, a part of the coating film after the heating
Data Source
AI summary
A method for producing a film includes: coating a surface of a substrate with a composition containing a polymer having a structural unit represented by formula (1) and having a number average molecular weight of 13000 or more and a solvent, heating a coating film formed by the coating, and removing, with a rinsing liquid, a part of the coating film after the heating, wherein the rinsing liquid to be used contains a basic compound. In the formula (1), Y1 is a single bond, —CO—NR2—, a divalent aromatic ring group, a divalent group containing —O—, or a divalent group containing —CO—NR2—. A1 is a single bond, —O—, —S—, or —NR3—. R1 is a hydrogen atom, a monovalent hydrocarbon group, a monovalent halogenated hydrocarbon group, or a monovalent group having a heterocyclic structure.


