Composite Conducting Layer for Film Button Circuit Assembly
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Solution Overview
Problem
Conventional film button circuit sheets have a large area requirement, high production costs, and complex processing due to the need for riveting connections between tongues and pin sockets, leading to increased costs and complexity.
Innovation Solution
A novel conducting structure where the upper and lower circuit sheets are bonded with a back glue layer, featuring composite conducting layers formed by sequential coatings of silver paste and carbon film layers, allowing for a thicker composite layer to create conduction pressure between contact points, enabling connection to a FPC connector through a flat cable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tongues are extended from upper and lower circuit sheets and connected by riveting to pin sockets, then electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates the riveting connection structure from the circuit sheet assembly. Instead of extending tongues that require riveting to pin sockets, the invention uses a self-contained FPC connector with built-in contact structures that directly engage with the circuit board, removing the complex riveting process while maintaining reliable electrical connection
Solution Approach 2:
The FPC connector acts as an intermediary component between the circuit sheets and the circuit board. It provides a standardized interface that simplifies the connection process, replacing the direct riveting method with a plug-and-play connector system that is easier to manufacture and assemble
2Reliability
If tongues are extended and connected by riveting, then electrical connection is established, but manufacturing cost increases
Solution Approach 1:
The patent removes the expensive riveting process from the manufacturing workflow. By using a FPC connector system, the connection is achieved through simple insertion and locking mechanisms that can be automated, significantly reducing labor costs and manufacturing complexity compared to precision riveting operations
Solution Approach 2:
The invention changes the connection method from mechanical riveting (permanent, complex) to a snap-fit or locked connector system (reversible, simple). This parameter change in the connection approach reduces manufacturing cost while maintaining connection reliability, as the new method is more suitable for automated assembly lines
3Adaptability or versatility
If a large area film button circuit sheet is used with matrix circuit, then button functionality is achieved, but area requirement and cost increase
Solution Approach 1:
The patent segments the button circuit functionality into modular components. Instead of a single large film button circuit sheet with a complete matrix, the system divides the functionality between the FPC connector (which provides the connection interface) and the circuit board (which hosts the matrix circuit). This segmentation allows the FPC to be smaller while maintaining full button functionality through the distributed architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces costs, simplifies machining, and enhances working reliability by eliminating the need for riveting and simplifying production, assembly, and testing processes while improving production efficiency.
Implementation Method 1
The composite conducting layer has a thickness slightly greater than that of the back glue layer to form a conduction pressure between the corresponding upper and lower sheet conducting contact points
Data Source
AI summary
A novel conducting structure and conducting method for an upper sheet and a lower sheet of a film button circuit. A first upper sheet conducting layer and a second upper sheet conducting layer are coated in sequence on an upper sheet conducting contact point. A first lower sheet conducting layer and a second lower sheet conducting layer are coated in sequence on a lower sheet conducting contact point. The first upper sheet conducting layer, the second upper sheet conducting layer, the second lower sheet conducting layer and the first lower sheet conducting layer are overlapped in sequence, thereby forming a composite conducting layer that is slightly greater than a back glue layer in thickness. The present invention can simplify assembly processes and can improve the production efficiency.