Dielectric Resin Film Capacitor for High-Temperature Breakdown Strength

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Film capacitors with polyester dielectric films face reduced breakdown voltage and increased variation under high-temperature conditions, making them unreliable for severe environments like in-vehicle use.

Innovation Solution

A film capacitor with a dielectric resin film having a glass transition temperature of 160° C. or higher and a density of 1.22 g/cm3 to 1.26 g/cm3, combined with a metal layer on at least one surface, enhances dielectric breakdown strength and withstand voltage at high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a polyester film with density of 1.45 to 1.50 g/cm3 is used as dielectric, then the breakdown voltage is improved at 25°C, but the breakdown voltage significantly decreases under high-temperature conditions

Engineering Contradiction:
Improvebreakdown voltageVSAvoidwithstand voltage at high temperature
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent changes the density parameter of the dielectric film from the conventional 1.45-1.50 g/cm3 range to a lower range of 1.20-1.35 g/cm3, while simultaneously adjusting the glass transition temperature to 150°C or higher. This parameter transformation resolves the contradiction by achieving adequate breakdown voltage at room temperature while maintaining reliability at high temperatures through the elevated glass transition temperature.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite dielectric film structure combining polyester with specific additives and modifiers that achieve the targeted density range of 1.20-1.35 g/cm3 and glass transition temperature of 150°C or higher. This composite approach allows optimization of both room temperature breakdown voltage and high temperature withstand voltage properties that cannot be achieved with conventional polyester alone.

Inventive Principle:
Principle #40Composite materials

2Quantity of substance

If the density of the polyester film is smaller than 1.45 g/cm3, then the manufacturing cost is reduced, but the variation in breakdown voltage increases

Engineering Contradiction:
ImprovedensityVSAvoidvariation in breakdown voltage
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent establishes a specific density range of 1.20-1.35 g/cm3 combined with a glass transition temperature of 150°C or higher, which resolves the contradiction by maintaining consistent electrical properties while reducing material density. This dual-parameter specification ensures manufacturing precision is maintained even at lower densities.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a film capacitor with sufficient dielectric breakdown strength and improved withstand voltage under high-temperature conditions, reducing the likelihood of dielectric breakdown and increasing reliability in harsh environments.

Implementation Method 1

a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm3 to 1.26 g/cm3

Methodology Applied
Scientific EffectGlass transition temperature:

Implementation Method 2

sufficient dielectric breakdown strength in a high-temperature environment

Methodology Applied
Scientific EffectDielectric breakdown:

Data Source

PatentUS11875944B2Film capacitor and film for film capacitor
Publication Date: 2024.01.16 MURATA MFG CO LTD
  • US11875944B2 patent drawing

AI summary

A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm3 to 1.26 g/cm3; and a metal layer on at least one surface of the dielectric resin film.