Film Cutting Apparatus for Semiconductor Packages
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Solution Overview
Problem
The existing methods for forming film-type semiconductor packages into desired shapes are time-consuming and costly, lacking efficiency in the production process.
Innovation Solution
A film cutting apparatus comprising a punch plate with protruded punches, die plates with corresponding holes, guide bars, elastic members, and an elevator to efficiently cut and separate film-type semiconductor packages, allowing for precise alignment and easy discharge of cut films, enabling the production of multiple packages with a single cutting operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional cutting methods are used to form film-type semiconductor packages, then the packages can be cut into desired shapes, but the production time and cost increase significantly
Solution Approach 1:
The patent combines multiple cutting operations into a single integrated die plate structure that can cut multiple film-type semiconductor packages simultaneously. The die plate includes multiple cavities and guide bars that work together in one operation, allowing parallel processing of multiple packages and thereby reducing total production time while increasing productivity.
Solution Approach 2:
The guide bars are pre-positioned within the die plate structure before the cutting operation begins. These guide bars are arranged to automatically align and guide the film during the cutting process, eliminating the need for time-consuming alignment adjustments during production and enabling faster, more efficient cutting operations.
2Ease of manufacture
If traditional cutting methods are used, then packages can be separated, but the cutting tools deform and the process becomes costly
Solution Approach 1:
The die plate is designed with locally optimized features including guide bars positioned at specific locations and cavities shaped to match the package geometry. This localized optimization distributes the cutting stress evenly across the die plate structure, preventing deformation at any single point and extending tool life while reducing manufacturing costs.
Solution Approach 2:
The guide bars are designed with sufficient thickness and rigidity to cushion and distribute the cutting force during the cutting operation. This beforehand cushioning prevents the guide bars and die plate from deforming under cutting stress, ensuring reliable, repeatable cutting results and reducing the frequency of tool replacement.
3Productivity
If multiple packages are produced with a single cutting operation, then efficiency increases, but precise alignment becomes difficult to maintain
Solution Approach 1:
The die plate is segmented into multiple independent cavities, each capable of producing a single film-type semiconductor package. Each cavity is surrounded by guide bars that independently guide the film through that specific region. This segmentation allows multiple packages to be produced simultaneously while maintaining precise alignment in each individual cutting zone.
Solution Approach 2:
The guide bars serve as intermediary elements between the film and the cutting cavities. These guide bars provide precise mechanical guidance and alignment for the film as it passes through each cavity, ensuring accurate positioning and cutting while enabling multiple packages to be produced in a single operation without sacrificing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus reduces production time and cost while increasing efficiency by allowing for precise cutting and separation of film-type semiconductor packages, enabling control over the timing of package production and minimizing deformation of cutting tools.
Implementation Method 1
a first elastic member provided between the first die plate and the punch plate; a second elastic member provided between the punch plate and the second die plate
Data Source
AI summary
A film cutting apparatus includes: a punch plate including a first punch protruded on an upper surface and a second punch protruded on a lower surface; a first die plate having a first hole corresponding to the first punch, the first die plate providing a surface on which a film is provided; a second die plate having a second hole corresponding to the second punch, the second die plate providing a surface on which a film is provided; at least two guide bars penetrating the first die plate and the punch plate and fixed to the second die plate; a first elastic member between the first die plate and the punch plate; a second elastic member between the punch plate and the second die plate; and an elevator configured to press the first die plate.