Film Deposition Device Buffering Substrate Support
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Solution Overview
Problem
Existing film deposition devices in semiconductor chip production suffer from substrate warping, fragmentation, and poor contact due to impact forces during substrate support adjustments, leading to unstable film deposition and particle contamination.
Innovation Solution
A film deposition device with a substrate supporting component featuring a supporting base, a supporting ring, and a buffer portion to absorb impact forces, along with independently controllable heaters and gas supply systems to ensure uniform temperature and pressure, thereby stabilizing substrate contact and improving film quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the supporting ring is moved relative to the supporting base to support or lift the substrate, then the substrate can be held and positioned, but impact force is generated causing substrate warping, fragmentation, and poor contact
Solution Approach 1:
The patent introduces a buffer portion on the supporting ring that provides cushioning before the substrate fully contacts the supporting ring. This beforehand cushioning absorbs the impact force during the movement process, preventing substrate warping and fragmentation while ensuring stable contact between the substrate and supporting components.
2Temperature
If the supporting base heats the substrate, then the central area of the substrate can absorb heat, but the peripheral area remains cooler causing temperature non-uniformity
Solution Approach 1:
The patent applies different heating approaches to different regions of the substrate. The supporting base provides heating to the central area through thermal conduction, while the supporting ring provides additional heating to the peripheral area. This local quality differentiation ensures uniform temperature distribution across the entire substrate surface, with the peripheral area receiving supplemental heat to match the central area temperature.
3Adaptability or versatility
If gaps exist between the substrate and supporting component, then the structure can accommodate substrate variations, but reactive gas enters the backside causing undesired film deposition and particle contamination
Solution Approach 1:
The patent introduces gas barrier layers as intermediary components between the reactive gas environment and the substrate backside. These gas barrier layers prevent reactive gas from entering through gaps and depositing on the substrate backside, thereby eliminating particle contamination while maintaining the adaptability of the supporting structure to accommodate substrate variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate warping and fragmentation, ensures stable contact between the substrate and the supporting component, and improves film uniformity and yield by maintaining consistent temperature and pressure across the substrate surface.
Implementation Method 1
the buffer portion can generate a buffering force at the instant of contact between the substrate and the supporting ring to absorb part of impact force formed between the supporting ring and the substrate
Implementation Method 2
The supporting base can heat the substrate. However, the supporting ring does not have a heating function, so the peripheral area of the substrate cannot absorb heat directly from the supporting base under vacuum conditions.
Data Source
AI summary
Disclosed is a film deposition device, having a substrate supporting component and comprising: a central shaft and a supporting base set on the top of the central shaft; a rotary shaft and a supporting ring set on the top of the rotary shaft, wherein the supporting ring is arranged around the supporting base, and the supporting base and the supporting ring are used for supporting a central area and an peripheral area of a substrate respectively; a first actuator connected to the rotary shaft for driving the supporting ring to rotate; a second actuator for driving the supporting ring and the supporting base to move relatively in a vertical direction; and a buffer portion for performing buffering when the substrate comes into contact with the supporting ring. The buffer portion can generate a buffer force at the moment when the substrate comes into contact with the supporting ring, so as to absorb part of the impact force formed between the supporting ring and the substrate when the supporting ring comes into contact with the substrate, so that the problems of warping and fragmenting of the substrate caused by the impact force and the poor contact between the substrate and the supporting base are avoided, the contact between the substrate and the supporting ring is more stable and more reliable, and the substrate and the substrate supporting component are tightly attached when coming into contact with each other.