Photosensitive Film Depressurization and Hydration Before Development

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Solution Overview

Problem

Existing substrate processing methods face challenges in maintaining consistent pattern formation due to variations in residual substances within the photosensitive film, which are influenced by differences in transfer times and residual substances remaining after exposure processes.

Innovation Solution

The method involves forming a photosensitive film on a substrate, exposing it in a first chamber, transferring it to a second chamber for pressure reduction to subatmospheric pressure, followed by hydration with a moisture-containing gas, and then developing the film, thereby reducing residual substances and stabilizing the film state.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the substrate is transferred quickly between chambers, then productivity is improved, but pattern formation consistency deteriorates due to variations in residual substances

Engineering Contradiction:
Improveprocessing throughputVSAvoidpattern formation consistency
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The pressure reduction process is performed as a preliminary action before development to remove residual substances from the photosensitive film. By conducting pressure reduction immediately after exposure and before development, the system prepares the film in advance to minimize variations in residual substances, ensuring consistent pattern formation while maintaining efficient throughput.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system changes the pressure parameter from atmospheric to subatmospheric during the pressure reduction process. This parameter change creates a pressure differential that facilitates the removal of residual substances from the photosensitive film, thereby improving pattern formation consistency without requiring extended transfer times that would reduce productivity.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If pressure reduction is performed to remove residual substances, then pattern formation consistency is improved, but processing time increases

Engineering Contradiction:
Improvepattern formation consistencyVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The pressure reduction process is integrated into the continuous processing flow between exposure and development chambers. By maintaining continuous substrate transfer and performing pressure reduction as an inline process rather than a separate batch operation, the system achieves effective residual substance removal without significant time loss, preserving high productivity while improving pattern consistency.

Inventive Principle:
Principle #20Continuity of useful action

3Manufacturing precision

If the substrate remains in the exposure chamber longer, then residual substances are reduced, but productivity decreases

Engineering Contradiction:
Improveresidual substance reductionVSAvoidprocessing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The pressure reduction chamber serves as an intermediary environment between the exposure and development chambers. Instead of extending the time in the exposure chamber, the system uses the pressure reduction chamber as a mediator to facilitate residual substance removal through pressure differential, thereby achieving the same effect without increasing the time in the exposure chamber and maintaining productivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces pattern variations between and within substrates by minimizing the influence of residual substances, enhancing processing efficiency and throughput.

Implementation Method 1

performing a pressure reduction process to reduce pressure inside the second chamber to a subatmospheric pressure

Methodology Applied
Scientific EffectPressure reduction: Depressurisation

Implementation Method 2

subjecting the photosensitive film to a moisture-containing gas

Methodology Applied
Scientific EffectAbsorption: Absorption (physical)

Data Source

PatentUS20260052941A1Substrate processing with reduction of pressure and hydration before development
Publication Date: 2026.02.19 TOKYO ELECTRON LTD
  • US20260052941A1 patent drawing
  • US20260052941A1 patent drawing
  • US20260052941A1 patent drawing

AI summary

A substrate processing method includes: forming a photosensitive film on a surface of a substrate; accommodating the substrate with the formed photosensitive film in a first chamber and exposing the photosensitive film to exposure light in the first chamber; accommodating the substrate with the formed photosensitive film in a second chamber different from the first chamber and performing a pressure reduction process to reduce pressure inside the second chamber to a subatmospheric pressure; subjecting, after the pressure reduction process, the photosensitive film to a moisture-containing gas; and developing the photosensitive film of the substrate after exposing and subjecting.