Equivalent Mechanical Parameters for Film Etching Regions
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Solution Overview
Problem
Calculating stress distribution and deformation in etching regions of film layers is complex due to their three-dimensional structure, making it time-consuming and impractical using traditional finite element methods, and existing methods struggle to obtain accurate equivalent mechanical parameters for irregular regions.
Innovation Solution
The method considers the etching region as an equivalent anisotropic planar blind plate, establishing a planar model and using finite element analysis to calculate stress distribution and deformation with equivalent mechanical parameters, including Poisson's ratios and elastic moduli, allowing for simpler and more efficient calculations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional finite element methods are used to calculate stress distribution and deformation in three-dimensional etching regions, then calculation accuracy is improved, but computational complexity and time consumption increase significantly
Solution Approach 1:
The patent transforms the three-dimensional etching region into a two-dimensional equivalent structure by changing the dimensional parameter. This dimensionality reduction simplifies the computational model while maintaining the essential mechanical characteristics, thereby reducing computational complexity without significantly compromising calculation accuracy for stress distribution and deformation analysis
Solution Approach 2:
The patent creates a simplified two-dimensional copy of the three-dimensional etching region. This equivalent planar model replicates the key mechanical behavior and stress characteristics of the original complex structure, allowing for efficient calculation while preserving the essential engineering parameters needed for design optimization
2Measurement precision
If traditional finite element methods are used for three-dimensional etching regions, then calculation accuracy is improved, but calculation time increases
Solution Approach 1:
By changing the dimensional parameter from three-dimensional to two-dimensional, the patent dramatically reduces the number of computational elements and iterations required. This parameter transformation maintains sufficient calculation accuracy for engineering purposes while reducing calculation time from potentially hours to minutes
Solution Approach 2:
The patent segments the complex three-dimensional problem into a simplified two-dimensional representation. This segmentation approach isolates the essential mechanical characteristics from unnecessary geometric complexity, enabling faster computation while retaining the critical stress and deformation information needed for etching region design
3Adaptability or versatility
If equivalent mechanical parameters are calculated for irregular etching regions, then applicability is improved, but calculation complexity increases
Solution Approach 1:
The patent applies parameter transformation by converting irregular three-dimensional geometries into equivalent two-dimensional planar representations. This dimensional reduction allows the method to handle any irregular shape while maintaining consistent calculation procedures, thereby improving versatility without proportionally increasing complexity
Solution Approach 2:
The patent creates a universal two-dimensional equivalent model that can represent various irregular three-dimensional etching regions. This universal approach allows the same calculation methodology to be applied across different geometries and configurations, enhancing adaptability while avoiding the need for geometry-specific complex modeling procedures
Data Source
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AI summary
The present disclosure provides a method for calculating equivalent mechanical parameters of a film layer etching region, the method comprising: selecting at least a part of the film layer etching region as an analysis region; establishing a planar model corresponding to the analysis region; performing grid division on the planar model at a first density; according to the actual mechanical parameters of film layer material and the grid division of the first density, analyzing, by means of a finite element method, a first simulation stress of the planar model in simulated boundary conditions; and calculating equivalent mechanical parameters, under the simulated boundary conditions, the equivalent mechanical parameters enabling an anisotropic planar blanking panel having the same size as that of the boundary of the planar model to reach the first simulated stress.