Film Forming Apparatus Control for Substrate Rotation Uniformity
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Solution Overview
Problem
Current film forming apparatuses face challenges in uniformly forming films on substrates due to inadequate control over the rotation and self-rotation of substrates during the film formation process, leading to inconsistencies in film quality and accuracy.
Innovation Solution
A control apparatus is integrated into the film forming apparatus, featuring a display control unit for setting parameters and a process execution unit that controls the rotation and self-rotation of substrates based on set parameters, ensuring precise control over the substrate's movement and gas supply during the film formation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate rotation and self-rotation are not precisely controlled, then the film formation process is simple, but the film uniformity and quality deteriorate
Solution Approach 1:
The control apparatus allows operators to adjust rotation speed parameters and self-rotation parameters independently to optimize film uniformity. By changing these operational parameters, the system achieves precise control over the substrate movement patterns during film formation, directly addressing the film uniformity issue without requiring structural modifications.
Solution Approach 2:
The control apparatus monitors the actual rotation and self-rotation of the substrate, comparing it against target values, and automatically adjusts the rotation mechanisms to maintain precise control. This feedback mechanism ensures consistent film quality while managing the complexity of controlling multiple rotational movements.
2Adaptability or versatility
If fixed rotation parameters are used, then the control system is simple, but the adaptability to different substrate types and processes deteriorates
Solution Approach 1:
The control apparatus enables dynamic adjustment of rotation parameters and self-rotation parameters based on the specific substrate type and film formation process requirements. Operators can modify these parameters in real-time or between batches, allowing the same equipment to adapt to different substrate characteristics without physical reconfiguration, thereby achieving versatility while maintaining relatively simple system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform film formation on substrates by synchronizing the rotation and self-rotation of substrates with the gas supply, improving film quality and accuracy by allowing for customizable settings for different substrate types and processes.
Implementation Method 1
a gas supply unit configured to supply a gas into the vacuum container
Implementation Method 2
a rotation table disposed in a vacuum container and configured to rotate around a central shaft of a table surface, thereby revolving a substrate on a disposing surface provided on a part of the table surface; a stage configured to rotate around the central shaft of the disposing surface, thereby rotating the substrate on the disposing surface
Implementation Method 3
a film forming apparatus that includes: a rotation table disposed in a vacuum container and configured to rotate around a central shaft of a table surface, thereby revolving a substrate on a disposing surface provided on a part of the table surface
Data Source
AI summary
A control apparatus is included in a film forming apparatus that includes: a rotation table disposed in a vacuum container and configured to rotate around a central shaft of a table surface, thereby revolving a substrate on a disposing surface provided on a part of the table surface; a stage configured to rotate around the central shaft of the disposing surface, thereby rotating the substrate on the disposing surface; and a gas supply unit configured to supply a gas into the vacuum container. The control apparatus includes: a display control unit configured to display a setting screen for setting a first parameter that controls a rotation of the substrate; and a process execution unit configured to form a film on the substrate while controlling the rotation of the substrate based on the set first parameter.