Component Manufacturing Film Roughness for Stable Suction Release
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Solution Overview
Problem
Existing adhesive films used in semiconductor and electronic component manufacturing struggle to maintain stable contact with suction tables across varying temperature environments, leading to difficulties in removing the film after suction is stopped, which affects working efficiency.
Innovation Solution
A film comprising a base layer with a specific surface roughness (0.1 µm ≤ Ra ≤ 2.0 µm and 1.0 µm ≤ Rz ≤ 15 µm) and an adhesive layer, designed to maintain effective contact with suction tables even under temperature changes, allowing for easy removal and stable operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a smooth film surface is used to maintain stable contact with suction tables, then contact stability is improved, but removal difficulty increases after suction is stopped
Solution Approach 1:
The invention changes the surface roughness parameter of the film from smooth (Ra < 0.05 µm) to a controlled rough range (0.05 µm ≤ Ra ≤ 2.0 µm). This parameter change allows the film to maintain stable contact with the suction table during processing while enabling easy removal after suction is stopped, resolving the contradiction between contact stability and removal ease.
2Manufacturing precision
If the film is tightly bonded to the suction table to prevent displacement, then positioning accuracy is improved, but removal time increases after suction is stopped
Solution Approach 1:
By adjusting the surface roughness parameter to the range of 0.05 µm ≤ Ra ≤ 2.0 µm, the film achieves optimal balance between positioning accuracy during suction and removal speed after suction. The controlled roughness prevents excessive bonding strength that would cause displacement while avoiding too weak bonding that would increase removal time.
3Ease of operation
If the film surface is made rough to facilitate removal, then removal ease is improved, but contact stability with suction table deteriorates
Solution Approach 1:
The invention identifies an optimal range for surface roughness (0.05 µm ≤ Ra ≤ 2.0 µm) that balances removal ease and contact stability. This parameter change prevents the film from being too smooth (which causes stable contact but difficult removal) or too rough (which causes easy removal but unstable contact).
Solution Approach 2:
The invention applies different surface quality characteristics to different functional requirements: the film surface has controlled roughness (Ra 0.05-2.0 µm) that provides sufficient friction for stable contact during processing while allowing easy release when suction is stopped, achieving local optimization for both contact stability and removal ease.
4Manufacturing precision
If the film is designed for strong adhesion to prevent movement during processing, then positioning accuracy is improved, but working efficiency decreases due to difficulty in removal
Solution Approach 1:
The invention changes the surface roughness parameter to optimize the balance between adhesion strength for positioning and ease of removal for productivity. The range 0.05 µm ≤ Ra ≤ 2.0 µm provides sufficient adhesion during processing while enabling quick removal, thereby improving working efficiency without sacrificing positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film ensures easy removal from suction tables after temperature changes, stabilizes contact, and enhances working efficiency, particularly in automated processes, while maintaining flexibility across different temperature ranges.
Implementation Method 1
the segmented semiconductor components are rearranged on a carrier, and sealed in the form of an array with a sealant
Implementation Method 2
the film comprises: a base layer; and an adhesive layer provided on one surface side of the base layer
Data Source
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AI summary
Provided are a film for manufacturing semiconductor component and a film for electronic component manufacture which can be easily removed from the table surface after stopping suction even when used in an environment accompanied by a change in temperature, and can stabilize the close contact state with the table surface. Furthermore, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture are provided. The present film 1 for component manufacture is a film used for a method for manufacturing a semiconductor component or an electronic component, and comprises a base layer 11 and an adhesive layer 12 provided on one surface 11a side of the base layer 11, and the Ra (µm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (µm) is 1.0 to 15. The present method uses the film 1 for component manufacture, and includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.