Overlapping Film Seals for Thin Airtight Circuit Assemblies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing devices with circuit members are limited in achieving further reduction in thickness due to the constraints of sealing technologies.
Innovation Solution
A device structure comprising a first and second sealing member, both formed from films, with frame films and circuit members that have exposed and seal portions, allowing for a closed space to be created with the sealing members overlapping, enabling the circuit members to be sandwiched and maintaining contact points for electrical connectivity while allowing the device to be extremely thin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermosetting resin composition is used to seal the circuit member, then the circuit member can be embedded and sealed, but the device thickness cannot be reduced further
Solution Approach 1:
The patent replaces the thick thermosetting resin sealing structure with thin film-based sealing members. The first and second sealing members are formed as thin films that can be laminated together, providing effective sealing while dramatically reducing the overall device thickness. This principle directly resolves the contradiction by using film structures to achieve both reliable sealing and thin profile.
Solution Approach 2:
The patent transitions from a vertical embedding structure (circuit member embedded in resin) to a laminated film structure (sealing members stacked in layers). This dimensional reorganization allows the sealing function to be achieved through horizontal lamination of thin films rather than vertical embedding, thereby reducing thickness while maintaining sealing effectiveness.
2Length of moving object
If the sealing structure is simplified to reduce thickness, then the device can be made thinner, but the closed space enclosure and airtightness may be compromised
Solution Approach 1:
The patent combines multiple sealing functions into a integrated film-based sealing structure. The first sealing member includes both a base film and a frame film that work together to enclose the circuit members. The second sealing member is laminated to the first, creating a combined sealing system that maintains airtightness through the cooperative action of multiple film components rather than relying on a single thick structure.
Solution Approach 2:
The sealing structure is segmented into distinct functional components: a base film for general sealing, a frame film for structural enclosure and forming the closed space, and multiple circuit members with exposed and seal portions. This segmentation allows each component to be optimized for its specific function while collectively achieving both thinness and airtightness.
Data Source
AI summary
A device includes a first sealing member, a second sealing member, a first circuit member and a second circuit member. The first sealing member basically includes a first film formed with an opening and includes a frame film. At least one of the first circuit member and the second circuit member includes an exposed portion and a seal portion which surrounds the exposed portion. The frame film has a film-seal portion and a circuit-seal portion. The film-seal portion is bonded to the first film to surround the opening. The circuit-seal portion is bonded to the seal portion to surround the exposes portion. The device is formed with a closed space which is enclosed by the first sealing member and the second sealing member. The exposed portion is exposed to the outer space located outside the device.