Film Surface Sound Sensor Module with Elastic Adhesive

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Solution Overview

Problem

Existing sound sensor modules face challenges in accurately detecting sound from various surfaces due to limitations in base member materials and connection methods, which lead to heat resistance issues, connection failures under stress, and noise caused by cavity deformation.

Innovation Solution

A film surface sound receiving type sound sensor module with an elastically deformable insulation adhesive layer on a flexible film, where a conductor pattern is formed, and a microphone is mounted without soldering, ensuring mechanical coupling and stable connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering is used to connect the microphone to the base member, then electrical connection is achieved, but heat resistance issues occur and connection failures happen under stress and repeated deformation

Engineering Contradiction:

Improveconnection stabilityVSAvoidheat resistance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent replaces the thermal field (soldering) with a mechanical field (conductive adhesive). Instead of using heat to create electrical connections, the invention uses a conductive adhesive layer that provides both mechanical bonding and electrical conductivity through its material properties, eliminating the need for thermal processing and associated heat resistance issues

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the connection method from a thermal process (soldering requiring high temperature) to a room-temperature mechanical bonding process using conductive adhesive. This parameter change in the connection process eliminates heat resistance requirements while maintaining reliable electrical and mechanical connections

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If a rigid base member is used to mount the microphone, then stable connection is achieved, but the sound sensor module cannot adapt to various shapes of solids and repeated deformation causes connection failure

Engineering Contradiction:

Improveadaptability to various solid shapesVSAvoidconnection stability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent employs a flexible base member with elastic properties that can deform to match various solid surface shapes. This flexible structure maintains stable electrical connections through the elastic conductive adhesive layer, which accommodates deformation while preserving contact between the microphone terminals and conductor patterns

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent introduces dynamic adaptability by making the base member elastic and deformable. The structure can dynamically adjust its shape to conform to different solid surfaces while maintaining connection integrity through the elastic properties of the conductive adhesive, which allows reversible deformation without connection failure

Inventive Principle:

Principle #15Dynamics

3Ease of manufacture

If a cavity structure is used in the base member, then microphone mounting is simplified, but cavity deformation causes noise in the sound detection path

Engineering Contradiction:

Improvemicrophone mounting simplicityVSAvoidsound detection accuracy

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent uses a flexible membrane structure that eliminates rigid cavities. The membrane can closely conform to the solid surface being monitored, providing a direct sound transmission path without cavity-induced noise, while still allowing microphone mounting on the opposite side of the membrane

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for the use of non-heat-resistant films, provides stable connections under deformation, and prevents noise by eliminating cavities in the sound path, resulting in accurate and stable sound detection.

Implementation Method 1

an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS11044563B2Film surface sound receiving type sound sensor module

Publication Date: 2021.06.22 JAPAN AVIATION ELECTRONICS IND LTD

AI summary

A base member with wiring and a microphone are provided. In the base member with wiring, an insulation adhesive layer, which is elastically deformable, is provided on one surface of a film, which has flexibility, and a conductor pattern is formed on the insulation adhesive layer. The microphone is mounted on the base member with wiring. A terminal of the microphone is in touch with the conductor pattern in face-to-face manner, and a part, on which the terminal is not formed, of a surface of the microphone and a part, on which the conductor pattern is not formed, of a surface of the insulation adhesive layer are bonded and mechanically coupled with each other.