Film-to-Substrate Bonding with Movable Clamping During Heating
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Solution Overview
Problem
Existing methods for connecting a film to a substrate often result in bulging due to thermal stresses, which can lead to unreliable connections and mechanical stress on the film.
Innovation Solution
A method involving the application of a clamping force within a clamping region, heating the film and substrate while allowing relative movement, and using a compressive force or weight elements to mitigate thermal expansion, combined with a contactless gas flow or mass elements to minimize mechanical stress, and employing a laser for precise heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the film is rigidly fixed during heating, then connection reliability improves, but thermal stress causes bulging and connection failure
Solution Approach 1:
The patent applies a clamping force that can move together with the film during thermal expansion, transforming the static fixation into a dynamic system. This allows the film to expand freely while maintaining contact with the substrate, preventing bulging while ensuring reliable connection.
Solution Approach 2:
The patent divides the film into a clamped region (where connection is needed) and a free region (where the film can expand). This segmentation allows different parts of the film to have different degrees of freedom, resolving the contradiction between connection reliability and thermal expansion accommodation.
2Stability of the object's composition
If the film is loosely mounted during heating, then bulging is prevented, but mechanical stresses are introduced and connection reliability decreases
Solution Approach 1:
The patent applies different mounting conditions to different regions of the film: the clamped region maintains firm contact for reliable connection, while the free region allows movement to accommodate thermal expansion. This local differentiation resolves the contradiction between stability and reliability.
3Force
If mechanical clamping tools are used, then clamping force is applied, but dirt and damage occur and tools wear
Solution Approach 1:
The patent replaces mechanical clamping tools with a gas flow (pneumatic system) to apply the clamping force. This substitution eliminates direct mechanical contact, preventing dirt accumulation, damage to the film, and tool wear, while still providing the necessary clamping force during heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents bulging and ensures a reliable, stress-free connection by maintaining contact and allowing for precise, reproducible bonding without mechanical damage.
Implementation Method 1
the film and/or the substrate is heated in a respective connecting region, wherein the film and the substrate are connected within the connecting region
Implementation Method 2
the clamping force is applied at least in the step of heating by a compressive force of at least one fluid flow directed at the film
Implementation Method 3
the clamping force is applied at least in the step of heating by the weight force of at least one mass element in contact with the film
Implementation Method 4
stresses that arise during the step of heating due to thermal expansion of the film and/or the substrate can advantageously degrade along the contact surface between the film and the substrate
Data Source
AI summary
A method for connecting a film (102) to a substrate (101) includes providing (402) a film (102) and a substrate (101), bringing (403) the film (102) and the substrate (101) together, applying (404) at least one clamping force in at least one clamping region (201), in which the clamping force acts to establish a contact of the film (102) with the substrate (101), and heating (405) the film (102) and/or substrate (101) in at least a respective connecting region (103) in which the film (102) and the substrate (101) are connected together. The clamping force is maintained during the heating process, yet the film (102) and the substrate (101) can be moved relative to one another in the clamping region (201).