Film Substrate Reinforcement Layout for Warp-Resistant Semiconductor Packaging
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Solution Overview
Problem
Semiconductor devices with thin film substrates are prone to warping due to their low stiffness, which can apply excessive stress to conductive patterns and cause cracks, especially in areas without electronic components, leading to reliability issues and alignment challenges during mounting.
Innovation Solution
Incorporating a reinforcement member with a thickness smaller than the electronic component, positioned around the adhesive on the film substrate, which connects the wiring layer through a via hole, enhancing the substrate's stiffness and reducing warping, and using a method involving via hole formation, adhesive curing, seed layer formation, and copper electroplating to create a stable wiring layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thin film substrate is used, then the device size is reduced, but the substrate stiffness is lowered causing warping and cracks
Solution Approach 1:
The substrate structure is segmented into multiple functional layers: a thin film substrate for miniaturization, a reinforcement member for stiffness, and an adhesive layer for bonding. This segmentation allows each layer to perform its specific function optimally while working together as a unified structure.
Solution Approach 2:
The invention uses a composite structure combining the thin film substrate with a reinforcement member and adhesive layer. This composite approach allows the thin substrate to maintain its size advantage while the reinforcement member compensates for the lost stiffness, preventing warping and cracks.
2Volume of moving object
If the substrate is made thinner to reduce device size, then miniaturization is achieved, but warping control becomes difficult
Solution Approach 1:
The substrate system is divided into functional segments including the thin film substrate, reinforcement member, and adhesive layer. This segmentation enables the thin substrate to be used for miniaturization while the reinforcement member specifically addresses warping control.
Solution Approach 2:
The reinforcement member is strategically positioned in specific areas of the substrate where warping is most likely to occur. This local reinforcement approach provides targeted stiffness enhancement without uniformly increasing the overall substrate thickness, maintaining miniaturization benefits.
3Manufacturing precision
If a reinforcement member with thickness smaller than the electronic component is used, then the wiring layer can be properly positioned, but the reinforcement effect is limited
Solution Approach 1:
The reinforcement member's thickness is specifically controlled to be smaller than the electronic component thickness. This creates a localized reinforcement zone that provides sufficient stiffness for wiring layer positioning while allowing the electronic component to protrude as needed for electrical connections.
Solution Approach 2:
The thickness parameter of the reinforcement member is precisely optimized to balance two competing requirements: providing enough reinforcement for wiring layer positioning accuracy while maintaining a profile that allows electronic component integration. This parameter optimization achieves both goals simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls warping, reduces cracks in the wiring layer, improves mounting accuracy, and allows for easier alignment with smaller substrates, enhancing the reliability and usability of semiconductor devices.
Implementation Method 1
an adhesive 20 on a first surface 11 of the film substrate 10
Implementation Method 2
a wiring layer 53 on a second surface 12 of the film substrate 10 opposite from the first surface, the wiring layer being connected to the electronic component 30 through a via hole 21
Implementation Method 3
a reinforcement member 40 in an area around the electronic component 30 on the adhesive 20, the reinforcement member having a thickness smaller than a thickness of the electronic component 30
Data Source
AI summary
A semiconductor device includes a film substrate, an adhesive on a first surface of the film substrate, an electronic component on the adhesive, a wiring layer on a second surface of the film substrate opposite from the first surface, and a reinforcement member in an area around the electronic component on the adhesive. The wiring layer is connected to the electronic component through a via hole piercing through the film substrate and the adhesive. The reinforcement member has a thickness smaller than the thickness of the electronic component.