Film Thickness Prediction Control for Substrate Coating Accuracy

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Solution Overview

Problem

Existing substrate processing systems lack an efficient method to predict and adjust the film thickness of coating films on substrates in real-time, leading to potential processing errors and substrate waste.

Innovation Solution

An information processing apparatus is introduced, featuring a prediction unit that calculates a predicted film thickness using a film thickness model and pre-data from the substrate processing apparatus, and an output unit that provides instruction information for substrate processing based on the predicted film thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If substrate processing is performed without accurate prediction and control, then processing can proceed quickly, but film thickness and line width accuracy deteriorate

Engineering Contradiction:

Improvefilm thickness accuracyVSAvoidprocessing time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The system performs preliminary actions by predicting film thickness and line width before substrate processing using a film thickness model and pre-data from the substrate processing apparatus. This prediction is done in advance to determine optimal processing conditions, eliminating the need for time-consuming trial-and-error adjustments during actual processing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system implements feedback by using a film thickness model that correlates substrate processing conditions with resulting film thickness and line width. The prediction unit continuously monitors and adjusts processing conditions based on predicted outcomes, creating a closed-loop control system that maintains high accuracy without requiring multiple processing cycles.

Inventive Principle:

Principle #23Feedback

2Productivity

If multiple substrates are processed without prediction capability, then processing volume increases, but substrate waste increases due to lack of accuracy control

Engineering Contradiction:

Improveprocessing volumeVSAvoidsubstrate waste

Core Design Contradiction:

ProductivityVSLoss of substance

Solution Approach 1:

The system determines optimal processing conditions in advance using the film thickness model and pre-data before actual substrate processing. This preliminary determination ensures that each substrate is processed with the correct parameters from the start, preventing waste even when processing large volumes of substrates continuously.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The substrate processing apparatus performs self-service by automatically predicting film thickness and line width, and autonomously determining optimal processing conditions without external intervention. This self-adjusting capability ensures consistent high accuracy across all substrates while maintaining efficient batch processing.

Inventive Principle:

Principle #25Self-service

3Manufacturing precision

If manual adjustment of processing conditions is used, then flexibility is maintained, but manufacturing precision deteriorates due to human error

Engineering Contradiction:

Improveline width accuracyVSAvoidcontrol system complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system replaces manual adjustment with an automated feedback control mechanism. The prediction unit uses the film thickness model to continuously monitor predicted film thickness and line width, automatically determining optimal processing conditions without human intervention. This eliminates human error while maintaining system flexibility through programmable adjustments.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system substitutes manual mechanical adjustment with an automated information processing system. The prediction unit calculates optimal conditions using computational algorithms based on the film thickness model, replacing human operators with an automated control system that provides consistent, high-precision control without increasing physical device complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS12228390B2Information processing apparatus, information processing method and computer-readable recording medium

Publication Date: 2025.02.18 TOKYO ELECTRON LTD

AI summary

An information processing apparatus includes a prediction unit configured to calculate, based on a film thickness model representing a relationship between a state of a substrate processing apparatus and a film thickness of a coating film formed on a front surface of a substrate by the substrate processing apparatus and pre-data representing the state of the substrate processing apparatus before the substrate is processed by the substrate processing apparatus, a predicted film thickness when the substrate is processed by the substrate processing apparatus; and an output unit configured to output, based on the predicted film thickness, instruction information on a processing of the substrate before the substrate is processed by the substrate processing apparatus.