Film Touch Sensor Insulation Layer Crack Prevention
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Solution Overview
Problem
Existing film touch sensors face challenges in peeling off from carrier substrates without damage, particularly due to issues with inorganic peeling agents and high-temperature processes that can cause thermal damage and cracks, and existing methods struggle with large-scale sacrificial layer removal and exposure of metal wirings to solvents.
Innovation Solution
A film touch sensor with a protective layer and insulation layer made from a binder resin containing specific resins with protected phenolic hydroxyl or carboxyl groups, epoxy groups, and oxetane groups, which provides thermal resistance and reduces crack occurrence during peeling off and high-temperature processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inorganic peeling-off agents such as diamond-like carbon or zirconium oxide thin films are used, then peeling-off capability is improved, but the base film and metal wirings are not smoothly peeled off and remain on the carrier substrate
Solution Approach 1:
The patent introduces an organic peeling-off agent layer as an intermediary between the inorganic peeling-off agent and the base film/metal wirings. This organic layer mediates the peeling-off process, enabling smooth separation while maintaining the benefits of inorganic agents. The organic layer acts as a buffer that prevents direct contact between the inorganic agent and the sensitive components, resolving the contradiction between peeling capability and peeling smoothness.
2Manufacturing precision
If high-temperature processes are used for deposition and annealing, then manufacturing precision is improved, but thermal damage such as wrinkles and cracks occurs in the insulation layer
Solution Approach 1:
The patent employs a sacrificial organic layer that is temporarily introduced during high-temperature processing and then removed afterward. This disposable layer withstands the high-temperature deposition and annealing processes, protecting the insulation layer from thermal damage. After serving its protective function during manufacturing, the layer is removed, leaving no residue that could cause harm.
Solution Approach 2:
The organic layer is applied beforehand to cushion and protect the insulation layer from thermal damage during high-temperature processes. By placing this protective layer in advance, the patent prevents wrinkles and cracks from forming in the insulation layer while still allowing high-temperature manufacturing procedures to be performed.
3Productivity
If sacrificial layer removal is performed on large-size substrates, then productivity is improved, but it becomes difficult to remove the sacrificial layer uniformly
Solution Approach 1:
The patent changes the physical and chemical parameters of the sacrificial layer by using an organic material with specific solubility characteristics. The organic layer is designed to be uniformly removable through solvent treatment, and its properties are optimized to ensure consistent removal across large-size substrates. This parameter optimization enables both high productivity and uniform removal quality.
4Ease of operation
If metal wirings are directly exposed to liquid solvents for sacrificial layer removal, then ease of operation is improved, but the metal wirings are damaged
Solution Approach 1:
The organic sacrificial layer serves as a protective intermediary between the liquid solvent and the metal wirings. During solvent treatment, the organic layer absorbs and distributes the solvent, preventing direct contact with the metal wirings. This intermediary function allows the ease of operation benefit from liquid solvent treatment while protecting the metal wiring integrity from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces crack occurrence during peeling off and suppresses thermal damage, maintaining electrode pattern integrity and flexibility, while allowing for efficient high-temperature processing without compromising sensitivity or adhesion.
Implementation Method 1
a binder resin including (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) an acrylic resin containing an oxetane group
Implementation Method 2
a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid decomposable group
Data Source
AI summary
A film touch sensor includes a separation layer; a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer that is a cured layer of a binder resin including (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) an acrylic resin containing an oxetane group, such that it is possible to suppress thermal damage such as wrinkles, or cracks of the insulation layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.