Film Touch Sensor Insulation Layer Thermal Crack Prevention
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Solution Overview
Problem
Current film touch sensors face challenges in peeling off from carrier substrates without cracking or thermal damage, especially during high-temperature processes, and require improved flexibility and resistance to maintain electrode pattern integrity.
Innovation Solution
A film touch sensor design incorporating a separation layer, a protective layer, and an electrode pattern layer with an insulation layer made from a polymer with specific repeating units, providing thermal resistance and elasticity to prevent cracks and maintain electrode pattern integrity during peeling and high-temperature processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a film touch sensor is peeled off from a carrier substrate, then the sensor can be transferred to a target substrate, but cracks occur during the peeling process
Solution Approach 1:
A buffer layer is formed between the film touch sensor and the carrier substrate to cushion and distribute the stress during peeling. This buffer layer absorbs the mechanical stress that would otherwise concentrate at specific points and cause cracks, thereby preventing crack formation while enabling successful transfer of the sensor to the target substrate.
2Manufacturing precision
If high-temperature deposition and annealing processes are applied to the film touch sensor, then the electrode patterns are formed, but thermal damage occurs
Solution Approach 1:
An insulation layer serving as a heat-resistant intermediary layer is formed between the electrode pattern and the buffer layer. This insulation layer has high thermal stability and acts as a protective barrier during high-temperature deposition and annealing processes, allowing the electrode patterns to be formed without transmitting excessive heat to the buffer layer and causing thermal damage.
3Adaptability or versatility
If the film touch sensor is made flexible for bending and folding, then portability is improved, but the sensor becomes more susceptible to cracks during peeling
Solution Approach 1:
The buffer layer provides beforehand cushioning that compensates for the reduced crack resistance inherent in flexible materials. By distributing the peeling stress across the buffer layer, the system enables flexible film touch sensors to be transferred without cracking, maintaining both flexibility and reliability.
4Ease of operation
If organic peeling-off agents are used to facilitate peeling, then peeling smoothness is improved, but organic material contaminates the surface of the base film and metal wirings
Solution Approach 1:
The buffer layer serves as an intermediary that enables mechanical peeling without requiring organic peeling agents. The buffer layer's designed adhesion properties allow for smooth peeling through controlled stress distribution, eliminating the need for chemical agents that would contaminate the surface of the base film and metal wirings.
Data Source
AI summary
A film touch sensor includes a separation layer, a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer formed by curing an insulation layer forming composition comprising a polymer having a repeating unit represented by Formula 1 or 2, such that it is possible to suppress thermal damage which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.