Film Touch Sensor Protective Layer for Thermal Crack Prevention
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Solution Overview
Problem
Current film touch sensors face challenges in peeling off from carrier substrates without damaging the base film or metal wirings, and they are prone to thermal damage during high-temperature processes due to lack of adequate protective layers, leading to cracks and reduced flexibility.
Innovation Solution
A film touch sensor with a protective layer made from a polymer with a specific repeating unit, providing thermal resistance, elasticity, and high transmittance, which covers the electrode pattern layer and includes a separation layer for easy peeling off from the carrier substrate, reducing crack occurrence and maintaining electrode pattern integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a film touch sensor is peeled off from a carrier substrate, then the sensor can be transferred to the final application, but cracks occur in the insulation layer and electrode patterns due to stress during peeling
Solution Approach 1:
A release layer is formed on the carrier substrate before forming the insulation layer and electrode patterns. This preliminary structure enables controlled peeling while protecting the sensitive components from stress-induced cracks during the transfer process
Solution Approach 2:
The release layer acts as a cushioning element that absorbs and distributes the stress during peeling, preventing direct transmission of mechanical stress to the insulation layer and electrode patterns, thereby preventing crack formation
2Manufacturing precision
If high-temperature deposition and annealing processes are used to improve electrode resistance, then electrical performance is enhanced, but thermal damage such as wrinkles and cracks occur in the insulation layer
Solution Approach 1:
The insulation layer serves as a protective intermediary between the electrode pattern and the thermal processing environment. By selecting materials with appropriate thermal stability, it shields the electrode pattern from thermal damage during high-temperature deposition and annealing processes
Solution Approach 2:
The patent specifies that the insulation layer should have a glass transition temperature of 80°C or higher. This parameter change ensures the material maintains structural integrity during high-temperature processing, preventing thermal damage while allowing electrical performance optimization
3Device complexity
If no protective layer is used during peeling, then the structure remains simple, but the base film and metal wirings are damaged or remain on the carrier substrate
Solution Approach 1:
A release layer is preliminarily formed on the carrier substrate before depositing the base film and metal wirings. This preliminary structure facilitates complete and damage-free peeling, ensuring all layers transfer together without residual material remaining on the carrier substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses thermal damage and crack formation during high-temperature processes, enhances peeling efficiency, and maintains low electrical resistance, ensuring the film touch sensor's flexibility and reliability.
Implementation Method 1
capable of suppressing thermal damage such as wrinkles, or cracks of an insulation layer, which may occur in high-temperature deposition and annealing processes, due to including an insulation layer having excellent thermal resistance
Implementation Method 2
A film touch sensor capable of significantly reducing an occurrence rate of cracks during peeling-off the same from a carrier substrate
Data Source
AI summary
A film touch sensor includes a separation layer, a protective layer which is disposed on the separation layer and is a cured layer of a polymer having a repeating unit represented by Formula 1 or 2, and an electrode pattern layer disposed on the protective layer, such that it is possible to suppress thermal damage such as wrinkles, or cracks of an protective layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.