Film Touch Sensor Separating Layer Peeling Process
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Solution Overview
Problem
Existing film touch sensors face challenges in peeling off from carrier substrates without damage, as inorganic peeling materials often leave residue and organic materials can transfer, while sacrificial layers are not effective in large-dimension processes and may cause physical damage.
Innovation Solution
A film touch sensor with a separating layer, such as polyimide-based polymers, and a method involving a separating layer with controlled peeling strength and surface energy to facilitate easy peeling off from the carrier substrate, preventing damage and residue, and including a protective layer to safeguard the electrode pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inorganic peeling material (diamond like carbon, zirconium oxide) is used on carrier substrate, then peeling process is facilitated, but wiring and base cannot be easily peeled off completely and organic material transfers to metal wiring and base
Solution Approach 1:
The patent introduces an organic peeling layer as an intermediary between the inorganic peeling material and the metal wiring/base combination. This organic layer acts as a mediator that enables complete peeling by transferring stress uniformly and preventing direct contact between the rigid inorganic layer and the delicate wiring/base, thereby avoiding material transfer and ensuring complete separation.
Solution Approach 2:
The patent employs a composite peeling structure consisting of both organic peeling layer and inorganic peeling material. This composite approach combines the advantages of both materials: the organic layer provides flexibility and stress distribution, while the inorganic layer provides scratch resistance and structural support, achieving both easy peeling and complete separation without damage.
2Ease of manufacture
If sacrificial layer is used that can be removed by light or solvent, then peeling is enabled, but the layer cannot be removed in large-dimension processes and various film materials cannot be applied in high-temperature process
Solution Approach 1:
The patent transitions from using sacrificial layers that rely on chemical removal (light or solvent) to an organic-inorganic composite peeling layer that enables mechanical peeling. This parameter change in the peeling mechanism allows the structure to withstand high-temperature processes and large-dimension manufacturing, as the peeling is achieved through controlled adhesion differences rather than chemical decomposition.
Solution Approach 2:
The organic peeling layer serves as a disposable sacrificial element that is intentionally designed to be removed during the peeling process. By making this layer specifically removable while keeping the inorganic peeling material intact, the patent enables the carrier substrate to be reused and the touched sensor structure to be cleanly separated without damaging other components.
3Ease of manufacture
If physical peeling-off process from carrier substrate is conducted, then separation is achieved, but physical damages are caused in the touch sensor
Solution Approach 1:
The patent applies beforehand cushioning by designing the organic peeling layer to absorb and distribute peeling stresses before they reach the delicate touch sensor components. This pre-cushioning mechanism prevents stress concentration and physical damage to the wiring and base during the peeling process, ensuring reliable separation without damage.
Solution Approach 2:
The organic peeling layer functions as a flexible thin film that conforms to the underlying structure and distributes peeling forces uniformly. This flexibility allows the peeling process to proceed without creating stress concentrations that could damage the rigid inorganic peeling material or the delicate touch sensor components, achieving damage-free separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the easy and damage-free peeling off of the film touch sensor from the carrier substrate, preventing tearing and curling, while ensuring the electrode pattern remains intact and the base film protects the pad area during peeling.
Implementation Method 1
A film touch sensor with a separating layer, such as polyimide-based polymers, and a method involving a separating layer with controlled peeling strength and surface energy to facilitate easy peeling off from the carrier substrate
Data Source
AI summary
A film touch sensor includes a separating layer, an electrode pattern layer including a sensing electrode disposed on the separating layer and a pad electrode disposed at one end of the sensing electrode, a circuit board connected to the pad electrode, and a base film formed on the sensing electrode and a pad area of the circuit board. The film touch sensor may be fabricated by forming a separating layer on a carrier substrate, forming an electrode pattern layer including a sensing electrode and a pad electrode on the separating layer, connecting a circuit board to the pad electrode, forming a base film on the electrode pattern layer and the circuit board, and peeling-off the separating layer from the carrier substrate.