Film Touch Sensor Separation Layer for Clean Peeling
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Solution Overview
Problem
Conventional film touch sensors face challenges in achieving perfect peeling of metal wiring from substrates due to ineffective inorganic releasing materials and issues with organic releasing materials, and they struggle with high temperature conditions and large-scale implementation, limiting their application on flexible displays.
Innovation Solution
A film touch sensor is developed with a separation layer formed on a carrier substrate, which serves as a peeling layer, an insulation layer for planarization or adhesion, and an elasticity-controlled protective layer to prevent crack generation, allowing for high definition and heat resistance, and enabling attachment to various base films without the need for post-peeling removal of the separation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inorganic releasing materials are used for peeling metal wiring from substrate, then peeling effectiveness is improved, but metal wiring and resin substrate remain on the substrate surface
Solution Approach 1:
A separation layer made of silicon resin is introduced as an intermediary between the substrate and the metal wiring/resin substrate composite. This separation layer acts as a mediator that enables complete and clean peeling, preventing the metal wiring and resin substrate from remaining on the substrate surface while maintaining effective peeling.
2Ease of manufacture
If organic releasing materials are used for peeling, then peeling is achieved, but the releasing materials come out from the surface of metal wiring and resin substrate
Solution Approach 1:
The silicon resin separation layer serves as an intermediary that prevents organic releasing materials from contaminating the surface of the metal wiring and resin substrate. By positioning the separation layer between the substrate and the peeling interface, it blocks the migration of releasing materials to the product surface.
3Device complexity
If touch sensor is directly formed on base film, then manufacturing is simplified, but heat resistance and high definition are compromised
Solution Approach 1:
The manufacturing process is segmented into two distinct stages: first forming the touch sensor on a carrier substrate that provides heat resistance and high definition, then transferring the completed touch sensor to the base film. This segmentation allows each stage to optimize for its specific requirements without compromise.
4Productivity
If conventional peeling methods are used, then peeling is attempted, but additional processing steps are required for post-peeling removal
Solution Approach 1:
The separation layer is pre-formed on the substrate before the metal wiring and resin substrate are deposited. This preliminary action ensures that the separation functionality is already in place, enabling direct peeling without requiring any additional post-peeling removal steps.
Data Source
AI summary
Disclosed are a film touch sensor in which a separation layer is formed on a carrier substrate prior to the formation procedures of the touch sensor and an insulation layer is formed to be used as a planarization layer, an adhesive layer or a base layer, and a method of preparing the film touch sensor.