Film Touch Sensor Separation Layer for Clean Peeling
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Solution Overview
Problem
Existing film touch sensors face challenges in achieving complete peeling-off of metal wirings from substrates due to inadequate peeling-off agents, leading to electrode damage and cracks, especially when using inorganic peeling-off agents, and face difficulties in high-temperature processes and large-size removals.
Innovation Solution
A film touch sensor is developed with a separation layer made of a chain polymer containing a side chain with alcoholic secondary or tertiary hydroxyl groups and a cross-linking agent, which provides excellent peelability and heat resistance, allowing for easy peeling-off without damage and eliminating the need for subsequent removal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If inorganic peeling-off agents (diamond-like carbon or zirconium oxide thin films) are used to facilitate the peeling-off process, then the peeling-off capability is improved, but the metal wirings and base film cannot be smoothly peeled-off, causing remaining material on the substrate and contamination
Solution Approach 1:
The patent changes the material parameter of the peeling-off agent from inorganic materials (diamond-like carbon, zirconium oxide) to organic materials with specific chemical compositions. The organic peeling-off agents have molecular structures designed to provide controlled adhesion strength, enabling complete and clean peeling-off of metal wirings and base films without leaving residues or causing contamination.
Solution Approach 2:
The patent employs composite material strategies by formulating organic peeling-off agents that combine multiple functional components. These composite organic materials integrate peeling-off functionality with protective capabilities, allowing them to facilitate complete separation while preventing electrode damage and cracks that occur with inorganic agents.
2Ease of operation
If organic peeling-off agents (silicone resin or fluorine resin) are used to improve peeling-off smoothness, then the peeling-off process is facilitated, but the metal wirings still cannot be completely peeled-off from the substrate
Solution Approach 1:
The patent modifies the chemical composition parameters of organic peeling-off agents by incorporating specific functional groups and molecular structures. This optimization of chemical parameters enhances the peeling-off effectiveness, enabling complete separation of metal wirings from the substrate while maintaining smooth peeling-off characteristics.
Solution Approach 2:
The patent develops organic peeling-off agents with optimized molecular structures that replicate and enhance the desirable properties of existing organic agents (silicone and fluorine resins) while eliminating their不足之处. The new agents copy the smooth peeling-off characteristic but improve upon the incomplete separation issue through refined chemical composition.
3Manufacturing precision
If sacrificial layers removable by light or solvent are used to enable complete peeling-off, then complete removal is achieved, but large-size removal becomes difficult and high-temperature processes cannot be performed
Solution Approach 1:
The patent changes the thermal stability parameter of peeling-off agents by developing organic materials with enhanced heat resistance. These optimized organic peeling-off agents maintain their structural integrity and peeling-off functionality at high temperatures, enabling the substrate to undergo high-temperature processing steps without compromising the peeling-off capability or causing agent degradation.
Solution Approach 2:
The patent employs disposable organic peeling-off agents that are designed to be removed completely after serving their purpose. These agents are optimized to provide complete peeling-off capability during the manufacturing process and are then discarded, eliminating the need for complex removal processes while enabling high-temperature processing in between.
4Manufacturing precision
If sacrificial layers are used to achieve complete removal of metal wirings, then complete peeling-off is achieved, but the process becomes complex and time-consuming for large-size substrates
Solution Approach 1:
The patent extracts the peeling-off function from complex multi-step sacrificial layer processes and consolidates it into a single organic peeling-off agent layer. This extracted and simplified approach maintains complete peeling-off capability while eliminating the complexity and time-consuming nature of sacrificial layer formation, pattern alignment, and multi-step removal processes.
Solution Approach 2:
The patent incorporates the peeling-off functionality directly into the organic base film layer during the initial fabrication stages. The organic peeling-off agent is applied preliminarily before metal wiring deposition, and its optimized composition ensures that peeling-off can be achieved in a single step without requiring subsequent complex removal processes, thereby improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances process efficiency, secures high accuracy and heat resistance, diversifies base film options, and suppresses curling issues, enabling easy peeling-off even after heating, thus improving the manufacturing and performance of touch sensors.
Implementation Method 1
a separation layer made of a specific component capable of preventing an occurrence of electrode damage and cracks while providing excellent peelability
Implementation Method 2
a separation layer made of a chain polymer including a side chain having an alcoholic secondary or tertiary hydroxyl group, and a cross-linking agent
Data Source
AI summary
A film touch sensor is prepared by performing a process in which a separation layer made of a specific component is formed on a carrier substrate, and an insulation film is formed on a transparent conductive film pattern, which is used as a planarization layer, an adhesive layer or a base layer.