Film Touch Sensor Separation Layer for Complete Peeling
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Solution Overview
Problem
Conventional film touch sensors face challenges in achieving perfect peeling of metal wiring from substrates, leading to incomplete separation and difficulties in applying flexible displays, especially when using inorganic releasing materials, and require high-temperature conditions that are not feasible for large-scale production.
Innovation Solution
A film touch sensor is developed with a separation layer formed on a carrier substrate, which is then separated and used as a covering wiring layer, along with an insulation layer and a pad pattern layer, allowing for high-definition and heat-resistant touch sensors that can be applied to various base films without the need for removing the separation layer, and incorporating an elasticity-controlled protective layer to prevent crack generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inorganic releasing materials are used to peel metal wiring from substrate, then peeling effectiveness is improved, but incomplete separation occurs with metal wiring and resin substrate remaining on substrate
Solution Approach 1:
The patent introduces a separation layer as an intermediary component between the metal wiring and the substrate. This separation layer is specifically designed to be removable and enables complete separation of the metal wiring and resin substrate from the substrate without leaving residues, thereby resolving the incomplete separation issue while maintaining ease of manufacture
Solution Approach 2:
The patent segments the structure by introducing a distinct separation layer that can be independently removed. This segmentation allows the metal wiring and resin substrate to be separated from the substrate in a controlled manner, achieving complete separation without the problems associated with using inorganic releasing materials
2Ease of manufacture
If organic releasing materials are used to peel metal wiring from substrate, then peeling effectiveness is improved, but releasing materials come out from surface of metal wiring and resin substrate
Solution Approach 1:
The separation layer serves as a clean intermediary that enables peeling without using organic releasing materials that contaminate the surface. The separation layer can be removed cleanly, preventing contamination of the metal wiring and resin substrate surfaces
Solution Approach 2:
The separation layer is designed as a temporary, disposable component that facilitates the peeling process and is then completely removed. This disposable approach avoids the contamination issues associated with organic releasing materials that remain on surfaces
3Device complexity
If touch sensor is directly formed on base film, then manufacturing process is simplified, but heat resistance and definition are reduced
Solution Approach 1:
The patent applies preliminary action by forming the touch sensor structure on a carrier substrate first, which provides better heat resistance and definition during manufacturing. The separation layer is then used to transfer the pre-formed sensor to the base film, maintaining both high quality and process simplicity
4Productivity
If separation layer is formed on carrier substrate and then separated, then productivity and efficiency are improved, but adhesion stability must be maintained
Solution Approach 1:
The separation layer exhibits local quality with different adhesion characteristics: strong adhesion to the carrier substrate during formation, and controlled release properties when separation is needed. This local quality differentiation enables both high productivity through efficient separation and adhesion stability during the manufacturing process
Data Source
AI summary
The present invention relates to a film touch sensor in which a separation layer is formed on a carrier substrate prior to the formation procedures of the touch sensor, and a method of preparing the film touch sensor. The film touch sensor according to the present invention comprises a separation layer; an electrode pattern layer formed on the separation layer and comprising a sensing electrode and a pad electrode formed at one end of the sensing electrode; and an insulation layer formed on the electrode pattern layer and used as a base film layer.