Film-Type Semiconductor Package Shared Test Pads
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Solution Overview
Problem
Conventional film-type semiconductor packages require costly replacement of test devices due to a one-to-one correspondence between output pins and test pads, making it impractical to test packages with increasing numbers of output pins, as existing test devices must match or exceed the number of output pins to function effectively.
Innovation Solution
Implementing a film-type semiconductor package with test pads shared by output channels, where common pads are shared by multiple output channels, and a test device with patterns shared by test channels, allowing for efficient testing using existing devices even when the number of output pins exceeds the number of test pins or input terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of output pins is increased to meet growing display requirements, then the testing capability and visual quality are improved, but the test device must be frequently replaced at high costs
Solution Approach 1:
The patent applies universality by enabling each test pin to serve multiple functions through shared test pads. Instead of requiring one dedicated test pad per output pin, multiple output pins share common test pads, allowing a single test pin to test multiple output channels sequentially. This multi-functional approach allows existing test devices with fewer test pins to test packages with more output pins, eliminating the need for frequent test device replacements.
Solution Approach 2:
The patent implements dynamics through the use of switching elements that dynamically connect different output pins to shared test pads during the testing process. The switching mechanism allows the test configuration to change dynamically, enabling one test pin to sequentially test multiple output channels by reconfiguring the connections. This dynamic reconfiguration replaces the static one-to-one correspondence of conventional testing.
2Measurement precision
If the number of test pads is equal to the number of output pins to ensure complete testing coverage, then the measurement precision is improved, but the device complexity and cost increase
Solution Approach 1:
The patent applies merging by combining multiple test pad functions into shared common test pads. Instead of having separate dedicated test pads for each output pin, the invention merges the testing function for multiple output pins into a single shared test pad. This consolidation reduces the total number of test pads required while maintaining complete testing coverage through sequential testing of merged channels.
Solution Approach 2:
The patent enables test pads to perform multiple functions by having them serve as common test pads for multiple output channels. A single test pad can sequentially test multiple output pins through the switching mechanism, making the test pad universal rather than dedicated to a single function. This multi-functionality reduces the overall number of test pads needed in the system.
3Reliability
If the number of test pins matches the number of output pins to enable effective testing, then the reliability of testing is improved, but the adaptability to packages with varying pin counts deteriorates
Solution Approach 1:
The patent implements dynamics through switching elements that dynamically reconfigure the connection between test pins and output pins during testing. This dynamic switching allows the same test device to adapt its configuration to match different pin counts in various semiconductor packages. The system can reliably test packages with varying numbers of output pins by dynamically connecting the appropriate number of test pins to the shared test pads, eliminating the need for exact pin count matching.
Solution Approach 2:
The patent makes test pins universal by enabling each test pin to test multiple output pins through shared test pads. Instead of requiring a dedicated test pin for each output pin, a single test pin can sequentially test multiple output channels by switching connections to shared test pads. This universality allows test devices with fewer test pins to reliably test packages with more output pins, improving compatibility across different package configurations.
Data Source
AI summary
Provided are a film-type semiconductor package and method using test pads shared by output channels, a test device, and a semiconductor device and method using patterns shared by test channels. The semiconductor device includes a film-type semiconductor package and a test device. The film-type semiconductor package outputs test signals through a plurality of test pads. The test device tests the film-type semiconductor package using the test signals. A printed circuit board (PCB) of the test device includes a plurality of common patterns, each of which connects at least two of a plurality of test channels to an input terminal, the test channels connecting the input terminals to the test pins. When the film-type semiconductor package, the method of testing the semiconductor package, the semiconductor device and the test device, and the method of testing the film-type semiconductor package in the semiconductor device are used, the film-type semiconductor package can be tested without replacing an existing test device.