Filmic Logic Circuit for Flexible Surface Integration
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Solution Overview
Problem
Existing technologies face challenges in providing flexible and cost-effective solutions for integrating logic circuits into products and packages, especially those with complex or irregular surfaces, while ensuring reliable identification and communication capabilities.
Innovation Solution
A filmic circuit assembly comprising a thin flexible IC, an auxiliary component like an RFID antenna, and an adhesive layer, which can be applied to a target surface as a heat transferable film, allowing for flexible mounting on various surfaces and enabling efficient identification and communication through near field communication protocols.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional rigid circuit boards are used for integrating logic circuits, then manufacturing precision and reliability are improved, but adaptability to complex or irregular surfaces deteriorates
Solution Approach 1:
The patent employs a flexible printed circuit board (FPCB) instead of a rigid circuit board, allowing the logic circuit to conform to complex or irregular surfaces while maintaining electrical connectivity and functional reliability. The flexible substrate enables the circuit to be mounted on surfaces with varying geometries without compromising integration stability.
Solution Approach 2:
The invention changes the physical state and mechanical properties of the circuit substrate from rigid to flexible, transforming the form factor to accommodate different surface types. This parameter change allows the same logic circuit to be adapted across diverse applications including curved, irregular, or movable surfaces while preserving operational reliability.
2Adaptability or versatility
If custom logic circuit designs are developed for specific applications, then functionality and performance are improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent utilizes a universal flexible printed circuit board platform that can be configured for different logic circuit applications through software programming rather than custom hardware design. The FPCB serves as a multi-functional substrate that can accommodate various logic circuit configurations, reducing the need for application-specific custom circuit board designs and lowering manufacturing costs.
Solution Approach 2:
Instead of creating custom physical circuit designs for each application, the invention uses programmable logic circuits on a standardized FPCB platform. The functionality is replicated through software configuration and programming, allowing the same physical substrate to serve multiple application purposes without requiring costly custom manufacturing for each variant.
3Productivity
If identification information is acquired through traditional reading methods, then simplicity is maintained, but speed and reliability of information acquisition deteriorate
Solution Approach 1:
The patent replaces traditional mechanical or optical reading methods with near field communication (NFC) technology for acquiring identification information. The NFC reader mounted on the logic circuit enables wireless, contactless communication with NFC tags, significantly increasing information acquisition speed and reliability while eliminating the need for physical contact or line-of-sight requirements of traditional methods.
Solution Approach 2:
The invention transitions from passive optical or mechanical information retrieval to active electromagnetic field-based NFC communication. This phase transition in communication methodology enables faster data exchange rates and more reliable information acquisition, particularly in environments where traditional reading methods may fail due to distance, angle, or surface conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The filmic circuit assembly provides a cost-effective, flexible, and reliable means to integrate logic circuits into products, enabling quick and reliable acquisition of identification information and improved interactivity with products or packages, even those having complex or irregular surfaces.
Implementation Method 1
an adhesive layer configured to affix the logic circuit and the auxiliary component to a target
Implementation Method 2
The filmic circuit assembly may be configured to be applied to a target, and may be heat transferable
Data Source
AI summary
A filmic circuit includes a circuit portion and a carrier layer. The circuit portion includes a logic circuit that includes, for example, plural logic gates configurable to receive an input and provide a corresponding logical output. The carrier layer is configured as a film. The circuit portion is affixed directly to the carrier layer or to an upper coat disposed adjacent to the carrier layer, and the carrier layer is configured to be releasable from the circuit portion after the filmic circuit assembly is affixed to a target. The circuit portion is configured to receive an adhesive layer configured to affix the filmic circuit assembly to the target.