Variable Wavelength Interference Filter Electrode Contact
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Solution Overview
Problem
Existing variable wavelength interference filters face difficulties in easily and reliably connecting electrodes due to the need for separate Au bumps and complex wiring configurations, which complicates the electrical connection process.
Innovation Solution
A configuration where the first and second electrodes on the substrates have contact with each other, eliminating the need for Au bumps or similar conductive members, and using a bonding layer to secure the substrates, allowing for a simpler and more reliable electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Au bumps are used to electrically connect the bonding pads, then electrical connection is achieved, but the manufacturing process becomes complex and reliability is compromised
Solution Approach 1:
The patent merges the electrical connection function and mechanical bonding function into a single integrated electrode structure. The first electrode on the first substrate and the second electrode on the second substrate directly contact each other through the bonding layer, eliminating the need for separate Au bumps. This integration simplifies the manufacturing process while maintaining reliable electrical connection between the bonding pads.
2Ease of operation
If extraction electrodes are disposed on both substrates, then voltage application is enabled, but wiring operation becomes difficult
Solution Approach 1:
The patent extracts the wiring complexity from the substrate assembly process. By providing extraction electrodes that extend from the drive electrodes and configuring them to contact through the bonding layer, the design separates the voltage application function from the complex wiring operation. The external connecting pads on the wiring substrate allow voltage to be applied without requiring complex wiring operations between opposing substrates.
3Reliability
If separate Au bumps are required for electrical connection, then electrical conductivity is achieved, but manufacturing time and cost increase
Solution Approach 1:
The patent combines the electrical connection function with the substrate bonding process itself. The bonding layer serves dual purposes: mechanically joining the substrates and providing the electrical connection path between the first electrode and second electrode. This eliminates the need for separate Au bump deposition and bonding steps, significantly improving manufacturing efficiency while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the electrical connection between electrodes, enhances the reliability of the connection, and reduces manufacturing complexity, while also allowing for accurate light intensity measurement and spectral analysis in optical modules.
Implementation Method 1
the first electrode on the first electrode surface and a second electrode on the second electrode surface have contact with each other to thereby electrically be connected to each other
Implementation Method 2
a flexible section on the second substrate to manage stress and enhance the reliability of the electrical connection
Data Source
AI summary
An etalon is provided with a fixed substrate and a movable substrate opposed to the fixed substrate. The fixed substrate is provided with a first bonding surface to be bonded to the movable substrate via a bonding film and a first electrode surface on which a part of the first electrode is formed. The movable substrate is provided with a second bonding surface to be bonded to the first bonding surface via the bonding film and a second electrode surface on which a part of the second electrode is formed. In the state in which the fixed substrate and the movable substrate are bonded to each other with the bonding film, the first electrode formed on the first electrode surface and the second electrode formed on the second electrode surface have contact with each other.