Multi-band Filter Module Segmentation for Coupling Reduction
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Solution Overview
Problem
Conventional multi-band filter modules suffer from coupling phenomena due to closely arranged output pads, leading to noise interference and reduced filtering accuracy, which degrades product yield and increases manufacturing costs.
Innovation Solution
A multi-band filter module is designed with filters spaced apart on separate substrates, packaged using wafer sealing and SIP technologies, reducing the number of output pads and integrating filters on the same substrate to minimize coupling and enhance manufacturing convenience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If four filters are arranged on one substrate in line, then the multi-band function is achieved, but the number of output pads increases and coupling phenomenon occurs
Solution Approach 1:
The filter module is divided into two separate substrates: a first substrate containing first and second filters, and a second substrate containing third and fourth filters. Each substrate is independently packaged with its own packaging substrate, distributing the output pads across multiple surfaces and reducing the number of pads on any single substrate, thereby reducing coupling phenomenon.
2Adaptability or versatility
If four filters are arranged on one substrate in line, then the multi-band function is achieved, but coupling phenomenon causes noise interference and reduces filtering accuracy
Solution Approach 1:
By segmenting the filters onto two separate substrates and packaging them independently, the physical distance between filters is increased and coupling paths are reduced, thereby minimizing noise interference and improving filtering accuracy for each frequency band.
3Adaptability or versatility
If filters are packaged with many output pads on one substrate, then all filters can be connected, but the size of the filter module increases
Solution Approach 1:
The output pads are distributed across multiple dimensions: some pads are located on the upper surface of each substrate, while corresponding pads are located on the lower surface. This three-dimensional pad distribution allows for reduced pad density on any single surface, enabling compact module size while maintaining full connectivity for all filters.
4Device complexity
If filters are arranged closely on one substrate, then the integration is high, but coupling phenomenon occurs and yield is degraded
Solution Approach 1:
The filter module is segmented into two independently packaged units, each containing two filters. This segmentation maintains integration within each packaged unit while eliminating coupling issues between units, thereby improving product yield and reliability.
Data Source
AI summary
A multi-band filter module and a method of fabricating the same are disclosed. At least one upper filter is deposited on an upper surface of a first substrate. The first packaging substrate packages the upper filter deposited on the first substrate. At least one lower filter is deposited on an upper surface of the second substrate. The second packaging substrate packages the lower filter deposited on the second substrate. The lower surface of the first substrate is joined to a lower surface of the second substrate to face each other.