Filter Support Structure for Image Sensor Stability
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Solution Overview
Problem
The stability and flatness of short brackets in image-capturing devices are difficult to control, leading to microparticles being captured by the image sensor chip, resulting in suboptimal image quality due to light spots caused by filter blockages.
Innovation Solution
The device incorporates a carrier substrate with image sensing chips, filter assemblies, and lens assemblies, where the filter elements are positioned to maintain a distance of 30 µm to 200 µm from the image sensing chips to prevent light spot capture, using support elements to accommodate the filter elements within openings, ensuring improved image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If short brackets are used to support the filter on the image sensor chip, then the device complexity is reduced, but the stability and flatness of the filter become difficult to control, leading to microparticles being captured by the image sensor chip
Solution Approach 1:
The filter support structure is segmented into multiple support points distributed across the carrier substrate, with each support point independently positioned to ensure overall stability and flatness of the filter assembly
Solution Approach 2:
The filter is positioned in a third dimension above the image sensor chip by using support elements that extend vertically from the carrier substrate, creating a controlled distance between the filter and the image sensor chip to prevent microparticle capture
2Length of stationary object
If the filter is positioned close to the image sensor chip to reduce device thickness, then the device dimensions are reduced, but microparticles on the filter are captured by the image sensor chip causing light spots
Solution Approach 1:
The vertical distance between the filter and the image sensor chip is optimized to a specific range (30-200 μm), which is sufficient to prevent microparticle light spots while maintaining compact device dimensions
3Object-affected harmful factors
If the filter is positioned far from the image sensor chip to avoid microparticle capture, then image quality is improved, but the device thickness increases
Solution Approach 1:
The filter-to-sensor distance is optimized to a specific range (30-200 μm) that balances image quality improvement with compact device dimensions, avoiding both too-close and too-far positioning
Data Source
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AI summary
A portable electronic device (Z), and an image-capturing device (S) and an assembling method thereof are provided. The image-capturing device (S) includes a carrier substrate (1), a first image sensing chip (2A), a first filter assembly (3A) and a first lens assembly (4A). The first image sensing chip (2A) is disposed on the bottom side (1002) of the carrier substrate (1) and electrically connected to the carrier substrate (1). The first filter assembly (3A) includes a first support element (31A) disposed on the carrier substrate (1) and a first filter element (32A) configured for cooperating with the first support element (31A). The first support element (31A) is configured to carry the first filter element (32A) such that a11 or a part of the first filter element (32A) can be received within the first through opening (1003). The shortest distance (D) between the first filter element (32A) and the first image sensing chip (2A) can range from 30 µm to 200 µm.