Filter Suspension Frame for Thermal Management in Communication Modules
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Solution Overview
Problem
Telecommunications infrastructure equipment faces challenges in thermal management due to the need to cool both high-power components, such as power amplifiers, and heat-sensitive low-power components, like integrated circuits, within reduced-sized enclosures, while preventing overheating.
Innovation Solution
A communication module design featuring a power amplifier, filter, and transceiver, with a filter suspension frame assembly that floats the transceivers relative to the primary module chassis, utilizing compressible standoffs for thermal conductivity and vibration damping, and integrating the components within a modular chassis to manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high-power components are placed in close proximity to low-power components to reduce enclosure size, then equipment size is reduced, but heat-sensitive low-power components are overheated by high-power components
Solution Approach 1:
The enclosure is segmented into distinct thermal zones: a first enclosure portion housing heat-generating components (power amplifiers, power supplies) and a second enclosure portion housing heat-sensitive components (integrated circuits, digital circuits). This spatial segmentation allows both high-power and low-power components to coexist in a compact overall enclosure while maintaining adequate thermal separation to prevent overheating of sensitive components.
2Temperature
If thermal isolation structures are added between components, then overheating is prevented, but device complexity increases
Solution Approach 1:
The enclosure structure merges multiple functions into a single integrated design: it provides mechanical housing for components, creates thermal zones through its segmented structure, and establishes thermal pathways to external heat sinks. The first and second enclosure portions are positioned and configured to simultaneously achieve component mounting, thermal isolation between components, and heat dissipation to external sinks, thereby reducing the need for additional separate thermal management devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design efficiently dissipates heat from high-power components while protecting low-power components from overheating, maintaining functionality and reducing costs through modular, prewired, and prepackaged components.
Implementation Method 1
utilizing compressible standoffs for thermal conductivity and vibration damping
Implementation Method 2
utilizing compressible standoffs for thermal conductivity
Data Source
AI summary
A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.