Filter Unit Harmonic Suppression in Substrate Processing
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Solution Overview
Problem
The uniformity of substrate processing in semiconductor manufacturing is compromised by harmonics generated from the impedance control unit and changes in cable impedance during the plasma etching process, affecting the consistency of plasma density and substrate treatment.
Innovation Solution
A substrate processing apparatus and method that incorporates a filter unit between the impedance control unit and the conductive component to filter out harmonics, specifically the third harmonic, thereby preventing their transfer to the ring unit and maintaining uniform plasma density despite cable impedance changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an impedance control unit is used to control plasma density on the substrate, then plasma density uniformity is improved, but harmonics are generated that deteriorate processing uniformity
Solution Approach 1:
A filter unit is introduced as an intermediary component between the impedance control unit and the coupling ring. This filter unit specifically removes harmonics generated by the impedance control unit before they can reach the coupling ring and affect plasma uniformity, thus resolving the contradiction between achieving plasma density control and avoiding harmful harmonic effects
2Reliability
If a cable connects the impedance control unit and coupling ring, then electrical connection is achieved, but cable impedance changes due to deterioration affecting processing uniformity
Solution Approach 1:
The filter unit is designed to specifically target and remove harmonics that are generated due to cable impedance changes and deterioration. By converting the harmful effect of cable deterioration into a filterable signal characteristic, the system maintains processing uniformity despite cable aging, as the filter removes the problematic harmonic components regardless of cable impedance variations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures improved uniformity of substrate processing and maintains consistent etching rates across different substrate processing apparatuses, even as cable impedance deteriorates, by effectively filtering out harmonics and stabilizing plasma density.
Implementation Method 1
a filter unit disposed between the ring unit and the impedance control unit... the filter unit may filter out harmonics generated by the impedance control unit to prevent the harmonics from being transferring to the ring unit
Implementation Method 2
For the RF electromagnetic fields, an RF generator applies an RF voltage to one of electrodes opposite to each other. The RF power applied by the RF generator excites a process gas supplied into a space within a chamber to generate plasma
Implementation Method 3
the etching process is a process of removing a selected heating region in a film formed on the substrate, and includes wet etching and dry etching. For the dry etching, an etching device using plasma is used
Data Source
AI summary
The inventive concept provides a substrate processing apparatus. The substrate processing apparatus may include a chamber having an interior space, a support unit that supports a substrate in the interior space, a ring unit disposed on an edge region of the support unit when viewed from above, an impedance control unit electrically connected to the ring unit to control a flow or density of plasma in an edge region of the substrate and a filter unit disposed between the ring unit and the impedance control unit.