Filtered Temporary Adhesive Composition for Clean Substrate Detachment
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Solution Overview
Problem
Existing temporary adhesive materials leave behind particles that can cause connection failures on substrate surfaces during the cleaning process in three-dimensional semiconductor packaging, particularly when copper electrodes are connected on the same surface of chips.
Innovation Solution
A temporary adhesive material composition comprising an organopolysiloxane mixture that undergoes hydrosilylation reaction, an organopolysiloxane that does not undergo hydrosilylation reaction, a catalyst, and an organic solvent, filtered through a 100 nm pore size filter, along with a cleaning method using specific cleaning solutions to reduce particle residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a hot-melt hydrocarbon compound is used as a temporary adhesive material, then the adhesive strength and heat resistance are improved, but particles remain on the substrate surface after cleaning causing connection failures
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive material from conventional hot-melt hydrocarbon compounds to a specific formulation containing organopolysiloxane (5-50 mass%), modified organopolysiloxane (5-40 mass%), and inert filler (30-60 mass%). This parameter change in material composition fundamentally alters the cleaning behavior and particle formation characteristics, eliminating the particle residue problem while maintaining adhesive performance.
Solution Approach 2:
The patent employs a composite material formulation combining organopolysiloxane, modified organopolysiloxane, and inert filler in specific proportions. This composite approach leverages the complementary properties of each component: organopolysiloxane provides adhesive strength, modified organopolysiloxane enhances cleaning removability, and inert filler maintains structural integrity, thereby achieving both strong adhesion and minimal particle residue.
2Strength
If the adhesive layer is made to withstand back-surface grinding and TSV formation steps, then the durability is improved, but the ease of detachment is reduced
Solution Approach 1:
The patent creates a dynamic adhesive system where the adhesive properties change under different conditions. The specific formulation of organopolysiloxane and modified organopolysiloxane allows the adhesive to maintain strong bonding during high-stress processes (grinding, TSV formation) but becomes easily removable under cleaning conditions, achieving both durability and ease of detachment through conditional responsiveness.
Solution Approach 2:
The patent utilizes parameter changes in the adhesive material's chemical structure and composition to achieve differential performance. The modified organopolysiloxane component specifically alters the adhesive's response to cleaning agents, enabling it to resist degradation during manufacturing steps while facilitating easy removal during cleaning, thus resolving the contradiction between durability and ease of detachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition and cleaning method significantly reduce the number of particles that can cause connection failures on substrate surfaces, ensuring a cleaner and more reliable semiconductor packaging process.
Implementation Method 1
an organopolysiloxane mixture that undergoes hydrosilylation reaction for crosslinking
Implementation Method 2
when the temporary adhesive material composition is passed through a filtration filter having a pore size of 100 nm or less
Data Source
AI summary
The present invention provides a temporary adhesive material composition for detachably bonding a substrate and a support, containing: (A) an organopolysiloxane mixture that undergoes hydrosilylation reaction for crosslinking; (B) an organopolysiloxane that undergoes no hydrosilylation reaction; (C) a catalyst; and (D) an organic solvent, in which when the temporary adhesive material composition is passed through a filtration filter having a pore size of 100 nm or less, the number of particles remaining after the filtration and having a particle size of 100 nm or more and 1000 nm or less is 20 particles/ml or less. As a result, temporary adhesive material composition leaving few particles that may cause connection failure in a substrate surface (circuit-forming surface) after cleaning, is provided.