Filtered Feedthrough Electronic Module Assembly Alignment
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Solution Overview
Problem
The manufacturing process of implantable medical devices is complex and costly due to incorrect assembly of filtered feedthrough electronic module assemblies, leading to inefficiencies and material waste.
Innovation Solution
A filtered feedthrough electronic module assembly with a non-conductive barrier and snap-fit protruding members is used to simplify the assembly process by preventing incorrect pin connections and eliminating the need for separate insulative sheaths and manual alignment, thereby reducing manufacturing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional assembly process with separate insulative sheaths and manual alignment is used, then manufacturing precision can be maintained, but device complexity and manufacturing time increase
Solution Approach 1:
The patent combines the insulative sheath and alignment features into a single integrated component. The insulative barrier is formed as an integral part of the EMA housing, eliminating the need for separate insulative sheaths and manual alignment procedures. This merging of functions reduces assembly complexity while maintaining manufacturing precision through the integrated design.
2Reliability
If manual assembly with epoxy adhesion is used, then reliable connection can be achieved, but productivity decreases and material waste increases
Solution Approach 1:
The patent replaces the manual epoxy adhesion process with an automated mechanical snap-fit connection system. The protruding members on the EMA housing engage with corresponding recesses in the feedthrough assembly, creating a self-aligning, tool-free connection. This mechanical substitution eliminates manual labor and epoxy application steps, significantly improving productivity while maintaining connection reliability through the engineered snap-fit mechanism.
3Manufacturing precision
If traditional assembly process is used, then manufacturing precision can be maintained, but loss of time and material waste increase
Solution Approach 1:
The patent incorporates preliminary alignment features directly into the EMA housing design. The protruding members are pre-positioned on the housing to automatically guide and align the EMA with the feedthrough assembly during insertion. This preliminary action eliminates the need for manual alignment procedures during assembly, reducing manufacturing cycle time while maintaining precision through the built-in alignment geometry.
4Reliability
If separate insulative sheaths are used, then electrical insulation can be ensured, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the electrical insulation function with the EMA housing structure itself. The insulative barrier is formed as an integral non-conductive portion of the housing, eliminating the need for separate insulative sheaths. This reduces the total component count and assembly complexity while maintaining electrical insulation reliability through the integrated non-conductive housing design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the assembly process, reduces material waste, and lowers production costs by ensuring correct alignment and connection of components, enhancing the efficiency and cost-effectiveness of implantable medical device manufacturing.
Implementation Method 1
The electronic module assembly includes a non-conductive block with protruding members that form a snap-fit mating configuration with a feedthrough assembly
Data Source
AI summary
An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.