Fin Assembly Heat Dissipation for High-Power LED Illumination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-power LED illumination apparatuses suffer from poor heat dissipation performance, leading to unstable operation due to complex and inefficient heat dissipation paths.
Innovation Solution
The illumination apparatus incorporates a fin assembly with oppositely arranged thermal connection and dissipation ends, forming angled connection lines, and utilizes a fan to direct airflow through the fins for efficient heat discharge, providing independent heat conduction paths for the light source and circuit board components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple illumination apparatuses are utilized for large-area shooting scenes, then the brightness is improved, but the space occupation and operational complexity increase
Solution Approach 1:
The patent combines multiple light sources (LED light-emitting units) into a single integrated high-power illumination apparatus, merging their functions to achieve strong brightness output while reducing the number of separate devices needed and simplifying operation
2Illumination intensity
If high-power LED light sources are used, then the brightness is improved, but the heat dissipation performance deteriorates
Solution Approach 1:
The heat dissipation system is segmented into multiple independent paths: one path through the first substrate and first heat dissipation module, and another path through the second substrate and second heat dissipation module, allowing heat from different light sources to be dissipated through separate channels to improve overall heat dissipation performance
Solution Approach 2:
Heat dissipation modules (including heat sinks and fans) are introduced as intermediary components between the high-power LED light sources and the environment, facilitating efficient heat transfer and dissipation without directly affecting the light sources
3Power
If high-power driving power circuits are used, then the brightness is improved, but the heat generation increases
Solution Approach 1:
The power circuit system is segmented with dedicated power supply modules for different light source groups, and heat dissipation is similarly segmented into multiple independent paths, allowing heat from high-power circuits to be managed separately and efficiently
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, simplifies the structure, reduces waste, and ensures stable operation by effectively managing heat from multiple components with varying power requirements.
Implementation Method 1
The fan is configured to generate a flowing airflow. The airflow generated by the fan is enabled to pass through the fins and flow out from the first thermal dissipation end and the second thermal dissipation end to drive a heat of the first thermal connection end and the second thermal connection end out of the fin assembly
Implementation Method 2
The light source assembly is in thermal connection with the first thermal connection end, and the circuit board is in thermal connection with the second thermal connection end
Data Source
AI summary
An illumination apparatus, including: a light source assembly, a circuit board, a fin assembly, and a fan. The fin assembly includes a plurality of fins arranged at intervals. The plurality of fins each has a first thermal connection end and a second thermal connection end arranged oppositely to each other, as well as a first thermal dissipation end and a second thermal dissipation end arranged oppositely to each other. The light source assembly is in thermal connection with the first thermal connection end, and the circuit board is in thermal connection with the second thermal connection end. The airflow generated by the fan is enabled to pass through the fins and flow out from the first thermal dissipation end and the second thermal dissipation end to drive a heat of the first thermal connection end and the second thermal connection end out of the fin assembly.